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SILICONWARE PRECISION INDUSTRIES CO LTD Patents: Active, 2019

SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents

25 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.

  • 2019-12-20: Application 16723233; Invention TEST EQUIPMENT AND TEST DEVICE THEREOF; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
  • 2019-11-21: Application 16691477; Invention METHOD FOR MANUFACTURING ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
  • 2019-11-21: Application 16690801; Invention METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL FORMED IN CONCAVE PORTION; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
  • 2019-11-18: Application 16686995; Invention ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
FiledApplicationInventionApplicantStatusGrantedPatentPublished asInventor nameInventor countryExaminer
2019-12-2016723233TEST EQUIPMENT AND TEST DEVICE THEREOFSiliconware Precision Industries Co., Ltd.Patented Case2023-09-0511747382US20210123962A1
Bo-Siang Fang
Kuang-Sheng Wang
Hsinjou Lin
Shao-Meng Sim
Mao-Hua Yeh
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
SHERIF, FATUMA G
2019-11-2116691477METHOD FOR MANUFACTURING ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2020-09-0110763237US20200091109A1
Yu-Min Lo
Chee-Key Chung
Chang-Fu Lin
Kuo-Hua Yu
Hsiang-Hua Huang
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
BLUM, DAVID S
2019-11-2116690801METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL FORMED IN CONCAVE PORTIONSiliconware Precision Industries Co., Ltd.Patented Case2024-04-3011973014US20200091059A1
Chang-Fu Lin
Chin-Tsai Yao
Chun-Tang Lin
Fu-Tang Huang
Taiwan
Taiwan
Taiwan
Taiwan
BAUMAN, SCOTT E
2019-11-1816686995ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2021-09-0711114412US20210104491A1
Hsin-Yi Liao
Cheng-Kai Chang
Taiwan
Taiwan
FERNANDES, ERROL V
2019-11-0416673078ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2021-10-1911152331US20200388591A1
Lung-Yuan Wang
Feng Kao
Mao-Hua Yeh
Taiwan
Taiwan
Taiwan
PHAM, LONG
2019-10-3116669872ELECTRONIC PACKAGE CARRIER STRUCTURE THEREOF, AND METHOD FOR FABRICATING THE CARRIER STRUCTURESiliconware Precision Industries Co., Ltd.Patented Case2020-12-0810863626
Yu-Lung Huang
Chee-Key Chung
Chang-Fu Lin
Yuan-Hung Hsu
Taiwan
Taiwan
Taiwan
Taiwan
NGUYEN, HOA CAO
2019-10-3116669796ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2022-08-1611418002US20210066883A1
Kong-Toon Ng
Yi-Chian Liao
Taiwan
Taiwan
THAI, DAVIS
2019-10-0716594714AUTOMATED ANTENNA TESTING DEVICESiliconware Precision Industries Co., Ltd.Patented Case2021-03-0910945140US20210067982A1
Cheng-Tsai Hsieh
Cheng-Shao Chen
Taiwan
Taiwan
PHAM, TUAN
2019-10-0116589663ELECTRONIC PACKAGE, ASSEMBLE SUBSTRATE, AND METHOD FOR FABRICATING THE ASSEMBLE SUBSTRATESiliconware Precision Industries Co., Ltd.Patented Case2022-07-0511382214US20210051800A1
Lung-Yuan Wang
Wen-Liang Lien
Taiwan
Taiwan
PATEL, ISHWARBHAI B
2019-09-2716585409ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE ELECTRONIC PACKAGING STRUCTURE WITH OPTICAL GUIDE DIE SEPARATE FROM ELECTRONIC PACKAGE AND PHOTONIC DIESiliconware Precision Industries Co., Ltd.Patented Case2021-10-1211143549US20210018360A1
Jin-Wei You
Cheng-Kai Chang
Taiwan
Taiwan
LE, QUE TAN
2019-09-1716573276METHOD FOR FABRICATING ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2022-01-1111222852US20200013728A1
Chih-Hsien Chiu
Chia-Yang Chen
Taiwan
Taiwan
ZARNEKE, DAVID A
2019-09-1216568990ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2024-06-0412002737US20200365489A1
Pin-Jing Su
Cheng-Kai Chang
Taiwan
Taiwan
SENGDARA, VONGSAVANH
2019-08-2916554952ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2021-08-0311081776US20210013583A1
Ying-Wei Lu
Bo-Siang Fang
Kuan-Ta Chen
Chia-Chu Lai
Taiwan
Taiwan
Taiwan
Taiwan
CRAWFORD, JASON
2019-08-2916554779CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRATE, AND METHODS FOR MANUFACTURING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2024-03-0511923337US20200350285A1
Chi-Ching Ho
Bo-Hao Ma
Yu-Ting Xue
Ching-Hung Tseng
Guan-Hua Lu
Hong-Da Chang
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
RAHMAN, MOHAMMAD A
2019-08-0716535022ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2020-11-1010833394US20200235462A1
Wen-Jung Tsai
Mao-Hua Yeh
Chih-Hsien Chiu
Ying-Chou Tsai
Chun-Chi Ke
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
TRAN, THUY V
2019-08-0716534789DETECTION DEVICE AND MANUFACTURING METHOD THEREOFSiliconware Precision Industries Co., Ltd.Patented Case2022-02-0111237189US20200309820A1
Kuo-Tung Chiang
Cheng-Kun Lee
Jin-Rong Guo
Taiwan
Taiwan
Taiwan
RODAK, LEE E
2019-08-0716534634TESTING SYSTEMSiliconware Precision Industries Co., Ltd.Patented Case2020-05-1910659097
Bo-Siang Fang
Kuan-Ta Chen
Ying-Wei Lu
Chia-Chu Lai
Cheng-Tsai Hsieh
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
PHAM, TUAN
2019-08-0716534385ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2021-09-0711114393US20200328166A1
Wen-Jung Tsai
Ching-Chia Chen
Ying-Chou Tsai
Taiwan
Taiwan
Taiwan
HOSSAIN, MOAZZAM
2019-08-0616533751ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOFSiliconware Precision Industries Co., Ltd.Patented Case2020-10-2010811378US20200303333A1
Chih-Hsien Chiu
Taiwan
HALL, VICTORIA KATHLEEN
2019-08-0616533716ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSIPATORSiliconware Precision Industries Co., Ltd.Patented Case2021-03-1610950520US20200168523A1
Yu-Lung Huang
Chee-Key Chung
Chang-Fu Lin
Kuo-Hua Yu
Wen-Shan Tsai
En-Li Lin
Kaun-I Cheng
Wei-Ping Wang
Korea, Republic Of
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
Korea, Republic Of
HALL, VICTORIA KATHLEEN
2019-07-1616513124ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2021-07-0611056470US20200402965A1
Kong-Toon Ng
Hung-Ho Lee
Chee-Key Chung
Chang-Fu Lin
Chi-Hsin Chiu
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
HO, TU TU V
2019-05-0916408389TESTING FIXTURESiliconware Precision Industries Co., Ltd.Patented Case2020-11-0310823776US20200072886A1
Bo-Siang Fang
Cheng-Tsai Hsieh
Kuan-Ta Chen
Ying-Wei Lu
Taiwan
Taiwan
Taiwan
Taiwan
PHAM, THAI N
2019-05-0616403877FABRICATION METHOD OF SEMICONDUCTOR STRUCTURESiliconware Precision Industries Co., Ltd.Patented Case2020-12-2210872870US20190259723A1
Yi-Cheih Chen
Sung-Huan Sun
Cheng-An Chang
Chien-Hung Wu
Fu-Tang Huang
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
THAI, DAVIS
2019-03-2116360511FABRICATION METHOD OF SEMICONDUCTOR PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2020-10-2010811367US20190287928A1
Hui-Chuan Lu
Chun-Hung Lu
Po-Yi Wu
Taiwan
Taiwan
Taiwan
LE, DUNG ANH
2019-02-2616285813ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2021-01-2610903167US20200203277A1
Jun-Chang Ding
Hong-Da Chang
Hsi-Chang Hsu
Taiwan
Taiwan
Taiwan
MENZ, DOUGLAS M