SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
26 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2016-12-19: Application 15383362; Invention METHOD FOR FABRICATING PACKAGE STRUCTURE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2016-12-08: Application 15372638; Invention ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2016-11-16: Application 15352856; Invention SUBSTRATE STRUCTURE WITH FILLING MATERIAL FORMED IN CONCAVE PORTION; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2016-11-16: Application 15352822; Invention ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2016-12-19 | 15383362 | METHOD FOR FABRICATING PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-10-23 | 10109572 | US20170162494A1 | Wei-Chung Hsiao | Taiwan | CLARK, JASMINE JHIHAN B |
| 2016-12-08 | 15372638 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-12-17 | 10510720 | US20180061810A1 | Chang-Fu Lin Chin-Tsai Yao Kuo-Hua Yu Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan | KOO, LAMONT B |
| 2016-11-16 | 15352856 | SUBSTRATE STRUCTURE WITH FILLING MATERIAL FORMED IN CONCAVE PORTION | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-12-31 | 10522453 | US20170207161A1 | Chang-Fu Lin Chin-Tsai Yao Chun-Tang Lin Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan | BAUMAN, SCOTT E |
| 2016-11-16 | 15352822 | ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-02-25 | 10573623 | US20180061809A1 | Chih-Hsien Chiu | Taiwan | BAUMAN, SCOTT E |
| 2016-11-02 | 15341100 | ELECTRONIC PACKAGE HAVING A PROTRUDING BARRIER FRAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-06-12 | 9997469 | US20180040568A1 | Yue-Ying Jian Wei-Ping Wang Tsung-Ming Li En-Li Lin Kaun-I Cheng Yu-De Chu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | SOWARD, IDA M |
| 2016-10-26 | 15334569 | FABRICATION METHOD OF CORELESS PACKAGING SUBSTRATE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-20 | 9899249 | US20170047240A1 | Yu-Cheng Pai Chun-Hsien Lin Shih-Chao Chiu Wei-Chung Hsiao Ming-Chen Sun Tzu-Chieh Shen Chia-Cheng Chen | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | HA, NATHAN W |
| 2016-10-19 | 15297452 | SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-01-23 | 9875981 | US20170040277A1 | Meng-Tsung Lee Yi-Che Lai Shih-Kuang Chiu | Taiwan Taiwan Taiwan | DINKE, BITEW A |
| 2016-10-17 | 15295010 | ELECTRONIC DEVICE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-05 | 10201086 | US20180042112A1 | Lu-Yi Chen Cheng-Hsiang Liu Chang-Lun Lu Jun-Cheng Liao Cheng-Yi Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | AYCHILLHUM, ANDARGIE M |
| 2016-10-14 | 15293858 | FABRICATION METHOD OF PACKAGING SUBSTRATE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-20 | 9899235 | US20170047230A1 | Chi-Ching Ho Ying-Chou Tsai Sheng-Che Huang | Taiwan Taiwan Taiwan | WRIGHT, TUCKER J |
| 2016-09-07 | 15258441 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-11-13 | 10128178 | US20170338173A1 | Lu-Yi Chen Hung-Yuan Li Chieh-Lung Lai Shih-Liang Peng Chang-Lun Lu | Taiwan Taiwan Taiwan Taiwan Taiwan | ARMAND, MARC ANTHONY |
| 2016-09-07 | 15258303 | SUBSTRATE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-08-14 | 10049975 | US20170229386A1 | Fang-Yu Liang Hung-Hsien Chang Yi-Che Lai Wen-Tsung Tseng Chen-Yu Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | AYCHILLHUM, ANDARGIE M |
| 2016-08-01 | 15224767 | SUBSTRATE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-05 | 10199341 | US20170317040A1 | Fang-Yu Liang Hung-Hsien Chang Yi-Che Lai Wen-Tsung Tseng Chen-Yu Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | ISAAC, STANETTA D |
| 2016-06-14 | 15181489 | ELECTRONIC PACKAGE WITH ANTENNA STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-09-11 | 10074621 | US20170278807A1 | Chih-Hsien Chiu Chi-Pin Tsai Chi-Liang Shih Ming-Fan Tsai Chia-Yang Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | ESKRIDGE, CORY W |
| 2016-05-24 | 15163045 | ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-06-12 | 9999132 | US20170231095A1 | Chih-Hsien Chiu Chia-Yang Chen Ying-Wei Lu Jyun-Yuan Jhang Ming-Fan Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | CARPENTER, ROBERT K |
| 2016-05-09 | 15149576 | ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKAGE, AND METHOD FOR MANUFACTURING THE ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-11-28 | 9831191 | US20170243834A1 | Chieh-Lung Lai Mao-Hua Yeh Hung-Yuan Li Shih-Liang Peng Chang-Lun Lu | Taiwan Taiwan Taiwan Taiwan Taiwan | SULLIVAN, CALEEN O |
| 2016-05-02 | 15143691 | METHOD FOR FABRICATING PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-12-20 | 9524944 | US20160247773A1 | Chun-Wei Yeh Chun-Hsien Shen Hsiu-Jung Li Ya-Yi Lai Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | ARROYO, TERESA M |
| 2016-04-08 | 15094125 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-06-12 | 9997477 | US20160225728A1 | Tsung-Hsien Tsai Heng-Cheng Chu Chien-Cheng Lin Chih-Hsien Chiu Hsin-Lung Chung Yude Chu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | RAHIM, NILUFA |
| 2016-03-30 | 15084762 | ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-20 | 9899309 | US20170256481A1 | Shih-Ching Chen Shih-Liang Peng Chieh-Lung Lai Jia-Wei Pan Chang-Lun Lu | Taiwan Taiwan Taiwan Taiwan Taiwan | CLARK, JASMINE JHIHAN B |
| 2016-03-29 | 15083421 | ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-05 | 10199317 | US20170201023A1 | Chih-Hsien Chiu Chia-Yang Chen Ying-Wei Lu Jyun-Yuan Jhang Ming-Fan Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | SMITH, GRAHAM P |
| 2016-03-23 | 15078418 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-04-18 | 9627226 | US20160204093A1 | Chun-Tang Lin Yi-Che Lai | Taiwan Taiwan | HARRISTON, WILLIAM A |
| 2016-03-18 | 15074110 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-11-07 | 9812340 | US20160196990A1 | Chiang-Cheng Chang Meng-Tsung Lee Jung-Pang Huang Shih-Kuang Chiu Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | JEAN BAPTISTE, WILNER |
| 2016-03-14 | 15069387 | SUBSTRATE STRUCTURE, ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-09-05 | 9754868 | US20170194238A1 | Ching-Wen Chiang Hsin-Chih Wang Chih-Yuan Shih Shih-Ching Chen | Taiwan Taiwan Taiwan Taiwan | LE, THAO P |
| 2016-03-08 | 15063592 | PACKAGING SUBSTRATE AND ELECTRONIC PACKAGE HAVING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-08-28 | 10062651 | US20170186702A1 | Fang-Yu Liang Hung-Hsien Chang Yi-Che Lai Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan | AMER, MOUNIR S |
| 2016-02-26 | 15054845 | METHOD FOR MANUFACTURING MULTI-CHIP PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-06 | 9887102 | US20160181126A1 | Tai-Tsung Hsu Cheng-Yu Chiang Miao-Wen Chen Wen-Jung Chiang Hsin-Hung Lee | Taiwan Taiwan Taiwan Taiwan Taiwan | RAHMAN, MOIN M |
| 2016-01-27 | 15008097 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-11-27 | 10141233 | US20170005023A1 | Lu-Yi Chen Chang-Lun Lu | Taiwan Taiwan | SALERNO, SARAH KATE |
| 2016-01-04 | 14986903 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-01-17 | 9548220 | US20160118271A1 | Kuan-Wei Chuang Chun-Tang Lin Yi-Chian Liao Yi-Che Lai | Taiwan Taiwan Taiwan Taiwan | PERT, EVAN T |