SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
35 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2017-10-16: Application 15784782; Invention METHOD OF FABRICATING ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2017-10-11: Application 15729842; Invention FABRICATION METHOD OF ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2017-09-29: Application 15720552; Invention PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2017-09-14: Application 15704388; Invention METHOD OF FABRICATING ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2017-10-16 | 15784782 | METHOD OF FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-05 | 10199320 | US20180040550A1 | Ching-Wen Chiang Kuang-Hsin Chen Sheng-Li Lu Hsien-Wen Chen | Taiwan Taiwan Taiwan Taiwan | DANG, PHUC T |
| 2017-10-11 | 15729842 | FABRICATION METHOD OF ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-19 | 10211082 | US20180047610A1 | Lu-Yi Chen Chang-Lun Lu | Taiwan Taiwan | VU, VU A |
| 2017-09-29 | 15720552 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-12-22 | 10872847 | US20180342446A1 | Shao-Tzu Tang Jia-Fong Yeh Yi-Hsuan Liu Mei-Chi Chen Ying-Chou Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | CLARK, SHEILA V |
| 2017-09-14 | 15704388 | METHOD OF FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-03-05 | 10224243 | US20180068896A1 | Shao-Tzu Tang Chang-Yi Lan Ying-Chou Tsai | Taiwan Taiwan Taiwan | CLARK, SHEILA V |
| 2017-09-07 | 15698136 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-07-02 | 10340228 | US20180068959A1 | Hui-Chuan Lu Chun-Hung Lu Po-Yi Wu | Taiwan Taiwan Taiwan | LE, DUNG ANH |
| 2017-09-01 | 15694613 | ELECTRONIC PACKAGE WITH CONDUCTIVE PILLARS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-05-05 | 10643974 | US20180342484A1 | Chih-Hsien Chiu Chia-Yang Chen Chih-Chiang He | Taiwan Taiwan Taiwan | HUYNH, ANDY |
| 2017-08-18 | 15680515 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-10-01 | 10431535 | US20180316083A1 | Jui-Feng Chen Chia-Cheng Hsu Wen-Jung Tsai Chia-Cheng Chen Cheng Kai Chang | Taiwan Taiwan Taiwan Taiwan Taiwan | LEE, CALVIN |
| 2017-08-04 | 15669273 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-01-29 | 10192834 | US20170338186A1 | Fu-Tang Huang Chun-Chi Ke | Taiwan Taiwan | VALENZUELA, PATRICIA D |
| 2017-08-01 | 15666005 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-10-09 | 10096541 | US20170330826A1 | Ching-Wen Chiang Hsin-Chih Wang Chih-Yuan Shih Shih-Ching Chen | Taiwan Taiwan Taiwan Taiwan | LE, THAO P |
| 2017-07-26 | 15660227 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-10-29 | 10461041 | US20180315715A1 | Chih-Hsien Chiu Chia-Yang Chen | Taiwan Taiwan | ZARNEKE, DAVID A |
| 2017-07-12 | 15648089 | SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE STRUCTURE HAVING THE PACKAGE SUBSTRATE, AND METHOD OF FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-09-04 | 10068842 | US20170309537A1 | Shih-Chao Chiu Chun-Hsien Lin Yu-Cheng Pai Wei-Chung Hsiao Ming-Chen Sun Tzu-Chieh Shen Chia-Cheng Chen | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | SHOOK, DANIEL P |
| 2017-07-11 | 15646695 | FABRICATION METHOD OF ELECTRONIC MODULE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-10-29 | 10461002 | US20170309534A1 | Lu-Yi Chen Chang-Lun Lu Shih-Ching Chen | Taiwan Taiwan Taiwan | PHAN, THIEM D |
| 2017-07-10 | 15645560 | FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-06-18 | 10325872 | US20170309585A1 | Yi-Cheih Chen Sung-Huan Sun Cheng-An Chang Chien-Hung Wu Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | THAI, DAVIS |
| 2017-06-28 | 15635446 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-06-09 | 10679914 | US20180254232A1 | Chieh-Lung Lai Cheng-Yi Chen Chun-Hung Lu Mao-Hua Yeh | Taiwan Taiwan Taiwan Taiwan | CHANG, JAY C |
| 2017-06-26 | 15632669 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-06-05 | 9991197 | US20170294372A1 | Chia-Cheng Chen Chi-Ching Ho Shao-Tzu Tang Yu-Che Liu Ying-Chou Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | YECHURI, SITARAMARAO S |
| 2017-06-20 | 15628416 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-01-26 | 10903088 | US20180286701A1 | Shu-Chi Chang Wei Ping Wang Hsien-Lung Hsiao Kaun-I Cheng | Taiwan Taiwan Taiwan Taiwan | JEFFERSON, QUOVAUNDA |
| 2017-06-15 | 15624590 | SUBSTRATE STRUCTURE, ELECTRONIC PACKAGE HAVING THE SAME, AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-07-06 | 11056442 | US20180254250A1 | Po-Hao Wang Chun-Tang Lin Shou-Qi Chang Yu-Hsiang Hsieh | Taiwan Taiwan Taiwan Taiwan | SEFER, AHMED N |
| 2017-06-13 | 15621337 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-11-27 | 10141266 | US20170287840A1 | Yu-Cheng Pai Wei-Chung Hsiao Shih-Chao Chiu Chun-Hsien Lin Ming-Chen Sun Tzu-Chieh Shen Chia-Cheng Chen | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | ULLAH, ELIAS |
| 2017-06-06 | 15615158 | FABRICATION METHOD OF CIRCUIT STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-05 | 10201090 | US20170273185A1 | Shao-Tzu Tang Ying-Chou Tsai | Taiwan Taiwan | CHEN, XIAOLIANG |
| 2017-05-30 | 15607872 | ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-27 | 9907186 | US20180063966A1 | Chih-Hsien Chiu Chen-Wen Huang Hsin-Lung Chung Wen-Jung Tsai Jia-Huei Hung Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | FOURSON III, GEORGE R |
| 2017-05-16 | 15596113 | ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-03-10 | 10587041 | US20180090835A1 | Chih-Yuan Shih Chih-Hsien Chiu Yueh-Chiung Chang Tsung-Li Lin Chi-Pin Tsai Chien-Cheng Lin Tsung-Hsien Tsai Heng-Cheng Chu Ming-Fan Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | CLARK, SHEILA V |
| 2017-05-09 | 15590111 | SUBSTRATE CONSTRUCTION AND ELECTRONIC PACKAGE INCLUDING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-07-23 | 10361150 | US20180269142A1 | Chee-Key Chung Yu-Min Lo Han-Hung Chen Chang-Fu Lin Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | WILBERT, DAVID S |
| 2017-05-02 | 15584281 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING CUTTING ENCAPSULATING BODY AND CARRIER TO FORM PACKAGES | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-09-11 | 10074613 | US20170236787A1 | Chih-Hsien Chiu Hao-Ju Fang Hsin-Lung Chung Cho-Hsin Chang Tsung-Hsien Tsai Chia-Yang Chen Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | ESKRIDGE, CORY W |
| 2017-04-27 | 15499446 | SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-06-09 | 10679932 | US20170294371A1 | Chang-Fu Lin Ho-Yi Tsai Chin-Tsai Yao | Taiwan Taiwan Taiwan | YUSHIN, NIKOLAY K |
| 2017-04-26 | 15497964 | FABRICATION METHOD OF WAFER LEVEL PACKAGING SEMICONDUCTOR PACKAGE WITH SANDWICH STRUCTURE OF SUPPORT PLATE ISOLATION LAYER AND BONDING LAYER | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-08-14 | 10049955 | US20170229364A1 | Chiang-Cheng Chang Meng-Tsung Lee Jung-Pang Huang Shih-Kuang Chiu | Taiwan Taiwan Taiwan Taiwan | CHEN, DAVID Z |
| 2017-04-21 | 15494034 | SUBSTRATE STRUCTURE HAVING CHAMFERS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-09-01 | 10763223 | US20170309579A1 | Po-Hao Wang Chang-Fu Lin Chun-Tang Lin Bo-Hao Chang | Taiwan Taiwan Taiwan Taiwan | TRAN, THANH Y |
| 2017-04-20 | 15492394 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-03-19 | 10236261 | US20180211925A1 | Fang-Lin Tsai Yi-Feng Chang Lung-Yuan Wang | Taiwan Taiwan Taiwan | JANG, BO BIN |
| 2017-04-04 | 15478508 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-12-25 | 10163662 | US20170207104A1 | Cheng-Chia Chiang Don-Son Jiang Lung-Yuan Wang Shih-Hao Tung Shu-Huei Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | TRAN, TONY |
| 2017-03-23 | 15467198 | CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-02-18 | 10566271 | US20170200671A1 | Yueh-Ying Tsai Fu-Di Tang Chien-Ping Huang Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan | CHANG, JAY C |
| 2017-03-22 | 15466063 | METHOD OF MANUFACTURING PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-27 | 9905438 | US20170236725A1 | Ming-Chen Sun Chun-Hsien Lin Tzu-Chieh Shen Shih-Chao Chiu Yu-Cheng Pai | Taiwan Taiwan Taiwan Taiwan Taiwan | CLARK, JASMINE JHIHAN B |
| 2017-03-10 | 15455704 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-08-29 | 9748183 | US20170186703A1 | Ching-Wen Chiang Cheng-Hao Ciou Cheng-Chieh Wu Kuang-Hsin Chen Hsien-Wen Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | SHOOK, DANIEL P |
| 2017-03-10 | 15455664 | ELECTRONIC COMPONENT | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-02-05 | 10199731 | US20170187117A1 | Chih-Hsien Chiu Heng-Cheng Chu Cheng-Yu Chiang | Taiwan Taiwan Taiwan | PHAN, THO GIA |
| 2017-02-23 | 15440390 | FABRICATION METHOD OF PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-12-04 | 10147615 | US20170229319A1 | Yu-Cheng Pai | Taiwan | NICELY, JOSEPH C |
| 2017-02-16 | 15434599 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2018-02-20 | 9899308 | US20170229387A1 | Wen-Tsung Tseng Yi-Che Lai Shih-Kuang Chiu Mao-Hua Yeh | Taiwan Taiwan Taiwan Taiwan | CLARK, JASMINE JHIHAN B |
| 2017-01-20 | 15411204 | FABRICATION METHOD OF PACKAGING SUBSTRATE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2019-01-29 | 10192838 | US20170133337A1 | Chien-Lung Chuang Po-Yi Wu Meng-Tsung Lee Yih-Jenn Jiang | Taiwan Taiwan Taiwan Taiwan | GEBREMARIAM, SAMUEL A |