SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
1 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2014-07-02: Application 14322372; Invention FABRICATION METHOD OF PACKAGING SUBSTRATE, AND FABRICATION METHOD OF SEMICONDUCTOR PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2014-07-02 | 14322372 | FABRICATION METHOD OF PACKAGING SUBSTRATE, AND FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-04-14 | 9006039 | US20140315353A1 | Chi-Ching Ho Yu-Chih Yu Ying-Chou Tsai | Taiwan Taiwan Taiwan | LE, DUNG ANH |