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SILICONWARE PRECISION INDUSTRIES CO LTD Patents: Active, 2018

SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents

28 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.

  • 2018-12-26: Application 16232840; Invention ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
  • 2018-12-26: Application 16232735; Invention CARRIER STRUCTURE AND PACKAGE STRUCTURE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
  • 2018-12-19: Application 16225230; Invention Method for fabricating package structure; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
  • 2018-12-06: Application 16211714; Invention METHOD FOR FABRICATING ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
FiledApplicationInventionApplicantStatusGrantedPatentPublished asInventor nameInventor countryExaminer
2018-12-2616232840ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2020-11-1710840581US20200052393A1
Bo-Siang Fang
Kuan-Ta Chen
Chia-Chu Lai
Taiwan
Taiwan
Taiwan
KARACSONY, ROBERT
2018-12-2616232735CARRIER STRUCTURE AND PACKAGE STRUCTURESiliconware Precision Industries Co., Ltd.Patented Case2022-02-0111239125US20200035573A1
Hsien-Lung Hsiao
Yu-Cheng Pai
Chia-Chi Lo
Szu-Hsien Chen
Shu-Chi Chang
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
GHYKA, ALEXANDER G
2018-12-1916225230Method for fabricating package structureSiliconware Precision Industries Co., Ltd.Patented Case2020-04-0710615055US20190122898A1
Chi-Hsin Chiu
Shih-Kuang Chiu
Taiwan
Taiwan
MAZUMDER, DIDARUL A
2018-12-0616211714METHOD FOR FABRICATING ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2020-02-1810566320US20190115330A1
Chi-Liang Shih
Chun-Chong Chien
Hsin-Lung Chung
Te-Fang Chu
Taiwan
Taiwan
Taiwan
Taiwan
TRAN, LONG K
2018-11-2016196503ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2020-10-2710818515US20200090952A1
Yu-Wei Yeh
Yen-Hung Lin
Chih-Yi Liao
Chih-Hsien Chiu
Taiwan
Taiwan
Taiwan
Taiwan
PRASAD, NEIL R
2018-11-1516192262ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2021-01-2610903547US20190363423A1
Ying-Wei Lu
Bo-Siang Fang
Kuan-Ta Chen
Taiwan
Taiwan
Taiwan
LOTTER, DAVID E
2018-10-2516170904ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2020-03-2410600708US20190164861A1
Wen-Shan Tsai
Chee-Key Chung
Chang-Fu Lin
Taiwan
Taiwan
Taiwan
THAI, DAVIS
2018-10-2216166811METHOD FOR FABRICATING ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2020-10-0610796970US20190057911A1
Lu-Yi Chen
Chang-Lun Lu
Taiwan
Taiwan
SALERNO, SARAH KATE
2018-10-1116157430METHOD FOR FABRICATING ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2019-09-0310403570US20190043798A1
Lu-Yi Chen
Hung-Yuan Li
Chieh-Lung Lai
Shih-Liang Peng
Chang-Lun Lu
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
ARMAND, MARC ANTHONY
2018-07-2416044154ELECTRONIC PACKAGE AND ELECTRONIC DEVICE HAVING THE ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2022-01-1111223117US20190319347A1
Bo-Siang Fang
Kuan-Ta Chen
Chia-Chu Lai
Ying-Wei Lu
Taiwan
Taiwan
Taiwan
Taiwan
DINH, TRINH VO
2018-05-3015993243ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2020-08-2510756438US20190273321A1
Han-Hung Chen
Chun-Yi Huang
Chang-Fu Lin
Rung-Jeng Lin
Kuo-Hua Yu
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
NGUYEN, HOANG V
2018-05-3015993108ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2019-09-1010410970US20190279937A1
Chih-Hsien Chiu
Chia-Yang Chen
Taiwan
Taiwan
THAI, DAVIS
2018-05-1515980255METHOD FOR MANUFACTURING ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2019-12-3110522500US20190252344A1
Yu-Min Lo
Chee-Key Chung
Chang-Fu Lin
Kuo-Hua Yu
Hsiang-Hua Huang
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
BLUM, DAVID S
2018-05-0915975380METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A PROTRUDING BARRIER FRAMESiliconware Precision Industries Co., Ltd.Patented Case2019-08-2710396040US20180261552A1
Yue-Ying Jian
Wei-Ping Wang
Tsung-Ming Li
En-Li Lin
Kaun-I Cheng
Yu-De Chu
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
PAREKH, NITIN
2018-05-0915975232FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUCTOR CHIPSSiliconware Precision Industries Co., Ltd.Patented Case2020-04-1410622323US20180261563A1
Lu-Yi Chen
Taiwan
CAMPBELL, SHAUN M
2018-05-0715972837ELECTRICAL TESTING METHOD OF INTERPOSERSiliconware Precision Industries Co., Ltd.Patented Case2021-03-1610950507US20180254227A1
Lu-Yi Chen
Chi-Hsin Chiu
Shih-Kuang Chiu
Taiwan
Taiwan
Taiwan
LE, SON T
2018-05-0415971534ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2020-08-1110741500US20190237374A1
Chen-Yu Huang
Chee-Key Chung
Chang-Fu Lin
Kong-Toon Ng
Rui-Feng Tai
Bo-Hao Ma
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
HU, SHOUXIANG
2018-04-2415961103ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2022-07-0511380978US20190123424A1
Shi-Min Zhou
Han-Hung Chen
Rung-Jeng Lin
Kuo-Hua Yu
Chang-Fu Lin
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
IMMANUEL, BAMIDELE ADEFOLARIN
2018-04-1115950734FABRICATION METHOD OF LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICESiliconware Precision Industries Co., Ltd.Patented Case2019-08-2710396021US20180233442A1
Fang-Lin Tsai
Yi-Feng Chang
Cheng-Jen Liu
Yi-Min Fu
Hung-Chi Chen
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
MOVVA, AMAR
2018-04-1015949847METHOD OF FABRICATING PACKAGING STRUCTURESiliconware Precision Industries Co., Ltd.Patented Case2019-09-0310403596US20180233478A1
Hsien-Wen Chen
Shih-Ching Chen
Chieh-Lung Lai
Taiwan
Taiwan
Taiwan
LUU, CHUONG A
2018-04-0415945308ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2019-07-1610354891US20190181021A1
Po-Hao Wang
Chih-Jen Yang
Yu-Chih Cheng
Chee-Key Chung
Chang-Fu Lin
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
THAI, DAVIS
2018-03-2815938271ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAMESiliconware Precision Industries Co., Ltd.Patented Case2020-04-2110629572US20190164941A1
Chi-Rui Wu
Fu-Tang Huang
Chia-Cheng Chen
Chun-Hsien Lin
Hsuan-Hao Mi
Yu-Cheng Pai
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
Taiwan
CLARK, SHEILA V
2018-01-3015883808FABRICATION METHOD OF ELECTRONIC PACKAGE HAVING EMBEDDED PACKAGE BLOCKSiliconware Precision Industries Co., Ltd.Patented Case2019-02-0510199331US20180158784A1
Meng-Tsung Lee
Fu-Tang Huang
Taiwan
Taiwan
YI, CHANGHYUN
2018-01-1115867924FABRICATION METHOD OF SUBSTRATE STRUCTURESiliconware Precision Industries Co., Ltd.Patented Case2020-09-0110764995US20180139840A1
Jin-Wei You
Chun-Lung Chen
Taiwan
Taiwan
TUGBANG, ANTHONY D
2018-01-1115867919FABRICATION METHOD OF SUBSTRATE HAVING ELECTRICAL INTERCONNECTION STRUCTURESSiliconware Precision Industries Co., Ltd.Patented Case2020-09-1510774427US20180135185A1
Po-Yi Wu
Chun-Hung Lu
Taiwan
Taiwan
KUE, KAYING
2018-01-1015867199FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATESiliconware Precision Industries Co., Ltd.Patented Case2019-09-0310403573US20180158774A1
Wei-Che Chang
Taiwan
NIESZ, JAMIE C
2018-01-1015867008METHOD OF FABRICATING SUBSTRATE STRUCTURESiliconware Precision Industries Co., Ltd.Patented Case2019-02-0510199345US20180138140A1
Hsin-Ta Lin
Ching-Wen Chiang
Taiwan
Taiwan
CLARK, SHEILA V
2018-01-0915866144FABRICATION METHOD OF ELECTRONIC PACKAGESiliconware Precision Industries Co., Ltd.Patented Case2019-09-0310403567US20180130727A1
Yan-Heng Chen
Chun-Tang Lin
Mu-Hsuan Chan
Chieh-Yuan Chi
Taiwan
Taiwan
Taiwan
Taiwan
LUU, CHUONG A