SILICONWARE PRECISION INDUSTRIES CO LTD Expired Patents
11 granted patents the USPTO lists as expired; the status gives the reason, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2020-04-27: Application 16859009; Invention ELECTRONIC PACKAGE; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
- 2020-01-06: Application 16734692; Invention INSPECTION EQUIPMENT FOR AN OVER THE AIR TESTING PROCESS AND TESTING DEVICE THEREOF; Applicant Siliconware Precision Industries Co., Ltd.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
- 2020-01-06: Application 16734617; Invention METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
- 2018-11-27: Application 16201239; Invention ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME; Applicant Siliconware Precision Industries Co., Ltd.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2020-04-27 | 16859009 | ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2022-03-29 | 11289794 | US20210203057A1 | Rung-Jeng Lin Han-Hung Chen Shi-Min Zhou Kuo-Hua Yu Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan Taiwan | AYCHILLHUM, ANDARGIE M |
| 2020-01-06 | 16734692 | INSPECTION EQUIPMENT FOR AN OVER THE AIR TESTING PROCESS AND TESTING DEVICE THEREOF | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2021-12-07 | 11193972 | US20210072307A1 | Bo-Siang Fang Kuan-Ta Chen Hsinjou Lin | Taiwan Taiwan Taiwan | NGUYEN, VINH P |
| 2020-01-06 | 16734617 | METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2022-03-29 | 11289409 | US20200144167A1 | Yueh-Ying Tsai Fu-Di Tang Chien-Ping Huang Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan | CHANG, JAY C |
| 2018-11-27 | 16201239 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2021-08-24 | 11102890 | US20200093006A1 | Ying-Chang Tseng Yuan-Hung Hsu Chang-Fu Lin | Taiwan Taiwan Taiwan | BOUIZZA, MICHAEL M |
| 2018-07-06 | 16028798 | ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2021-07-20 | 11069633 | US20190214352A1 | Ming-Fan Tsai Chih-Hsien Chiu Tsung-Hsien Tsai Chao-Ya Yang Chia-Yang Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | LOTTER, DAVID E |
| 2017-06-16 | 15625083 | METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC COMPONENT | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2018-06-19 | 10002825 | US20170352615A1 | Shih-Chao Chiu Chun-Hsien Lin Yu-Cheng Pai Wei-Chung Hsiao Ming-Chen Sun Tzu-Chieh Shen Chia-Cheng Chen | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | SCHOENHOLTZ, JOSEPH |
| 2017-01-04 | 15397927 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2018-05-22 | 9978673 | US20180061747A1 | Shao-Tzu Tang Jia-Fong Yeh Chien-Hui Wang Chung-Yan Huang Ying-Chou Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | ROMAN, ANGEL |
| 2016-10-20 | 15298480 | METHOD FOR FABRICATING PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2018-02-20 | 9899335 | US20170103953A1 | Chih-Hsien Chiu Hsin-Lung Chung Cho-Hsin Chang Chia-Yang Chen Chao-Ya Yang | Taiwan Taiwan Taiwan Taiwan Taiwan | MARUF, SHEIKH |
| 2014-05-29 | 14290217 | LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2018-05-15 | 9972564 | US20150206814A1 | Fang-Lin Tsai Yi-Feng Chang Cheng-Jen Liu Yi-Min Fu Hung-Chi Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | MOVVA, AMAR |
| 2013-11-13 | 14078845 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH MICRO-ELECTROMECHANICAL ELEMENT | Siliconware Precision Industries Co., Ltd. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2014-06-03 | 8741693 | US20140080242A1 | Chun-An Huang Hsin-Yi Liao Shih-Kuang Chiu | Taiwan Taiwan Taiwan | MENZ, LAURA MARY |
| 2012-10-04 | 13644561 | PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 | 2014-08-19 | 8810045 | US20130334694A1 | Chi-Ching Ho Yu-Chih Yu Ying-Chou Tsai | Taiwan Taiwan Taiwan | LE, DUNG ANH |