SILICONWARE PRECISION INDUSTRIES CO LTD Patent Applications Rejected
2 applications abandoned without a patent; the status gives the reason, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2021-04-27: Application 17241199; Invention METHOD FOR FABRICATING ELECTRONIC STRUCTURE WITH CONDUCTIVE ELEMENTS ARRANGED FOR HEATING PROCESS; Applicant Siliconware Precision Industries Co., Ltd.; Status Abandoned -- Failure to Respond to an Office Action.
- 2021-02-09: Application 17171764; Invention ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Abandoned -- Failure to Respond to an Office Action.
| Filed | Application | Invention | Applicant | Status | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|
| 2021-04-27 | 17241199 | METHOD FOR FABRICATING ELECTRONIC STRUCTURE WITH CONDUCTIVE ELEMENTS ARRANGED FOR HEATING PROCESS | Siliconware Precision Industries Co., Ltd. | Abandoned -- Failure to Respond to an Office Action | US20210351097A1 | Chih-Chiang He Yu-Wei Yeh Chia-Yang Chen Chih-Yi Liao Chih-Hsien Chiu Chang-Chao Su | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | CHEN, DAVID Z |
| 2021-02-09 | 17171764 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Abandoned -- Failure to Respond to an Office Action | US20220189900A1 | Chia-Yu Kuo Rui-Feng Tai Yih-Jenn Jiang Don-Son Jiang Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan Taiwan | SYLVIA, CHRISTINA A |