SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
37 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2020-12-28: Application 17135161; Invention ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2020-12-28: Application 17134925; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2020-12-17: Application 17125195; Invention ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATING THE SAME; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2020-12-16: Application 17123630; Invention METHOD FOR FABRICATING ELECTRONIC PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2020-12-28 | 17135161 | ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2023-10-17 | 11791300 | US20220148996A1 | Fang-Lin Tsai Chia-Yu Kuo Pei-Geng Weng Wei-Son Tsai Yih-Jenn Jiang | Taiwan Taiwan Taiwan Taiwan Taiwan | KARIMY, TIMOR |
| 2020-12-28 | 17134925 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2023-08-29 | 11742296 | US20220148975A1 | Wei-Jhen Chen Chih-Hsun Hsu Yuan-Hung Hsu Chih-Nan Lin Chang-Fu Lin Don-Son Jiang Chih-Ming Huang Yi-Hsin Chen | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | CLINTON, EVAN GARRETT |
| 2020-12-17 | 17125195 | ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2023-03-07 | 11600571 | US20210104465A1 | Jun-Chang Ding Hong-Da Chang Hsi-Chang Hsu | Taiwan Taiwan Taiwan | MENZ, DOUGLAS M |
| 2020-12-16 | 17123630 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2023-08-15 | 11728178 | US20210143021A1 | Shu-Chi Chang Wei-Ping Wang Hsien-Lung Hsiao Kaun-I Cheng | Taiwan Taiwan Taiwan Taiwan | JEFFERSON, QUOVAUNDA |
| 2020-12-15 | 17122289 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-04-26 | 11315881 | US20220130769A1 | Chi-Ching HO Bo-Hao MA Chee-Key CHUNG | Taiwan Taiwan Taiwan | VU, VU A |
| 2020-12-01 | 17108399 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-07-26 | 11398429 | US20220093518A1 | Cheng Kai Chang Chang-Fu Lin Don-Son Jiang | Taiwan Taiwan Taiwan | LE, THAO P |
| 2020-11-24 | 17102841 | ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC COMPONENT | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-04-30 | 11973047 | US20220068867A1 | Feng Kao Lung-Yuan Wang | Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2020-11-23 | 17101277 | ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRONIC STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-05-14 | 11984393 | US20220068801A1 | Feng Kao Lung-Yuan Wang | Taiwan Taiwan | SCHOFIELD, TENLEY HOPE |
| 2020-11-12 | 17096359 | METHOD FOR FABRICATING PACKAGE STRUCTURE HAVING ENCAPSULATE SENSING CHIP | Siliconware Precision Industries Co., Ltd. | Patented Case | 2022-08-02 | 11404361 | US20210066173A1 | Shao-Tzu Tang Jia-Fong Yeh Yi-Hsuan Liu Mei-Chi Chen Ying-Chou Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | CHAMBLISS, ALONZO |
| 2020-11-02 | 17086888 | METHOD FOR FABRICATING CARRIER STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2023-10-17 | 11792938 | US20210068260A1 | Yu-Lung Huang Chee-Key Chung Chang-Fu Lin Yuan-Hung Hsu | Taiwan Taiwan Taiwan Taiwan | NGUYEN, DONGHAI D |
| 2020-10-19 | 17073783 | CHIP MATCHING SYSTEM AND METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-12-20 | 11532495 | US20220068680A1 | Wu-Hung Yen Yi-Hsien Huang Chun-Tang Lin Shu-Hua Chen Shou-Qi Chang | Taiwan Taiwan Taiwan Taiwan Taiwan | SHAMSUZZAMAN, MOHAMMED |
| 2020-10-13 | 17068988 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-12-06 | 11521930 | US20220068663A1 | Yu-Lung Huang Chih-Ming Huang Kuo-Hua Yu Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan | CLINTON, EVAN GARRETT |
| 2020-08-19 | 16997173 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2023-09-19 | 11764162 | US20210210435A1 | Ming-Fan Tsai Chih-Wei Chen Tsung-Hsien Tsai Chao-Ya Yang Chia-Yang Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | SUN, YU-HSI DAVID |
| 2020-08-19 | 16997096 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-03-08 | 11271313 | US20210083389A1 | Cheng-Piao Tung Wen-Jung Tsai | Taiwan Taiwan | JEAN PIERRE, PEGUY |
| 2020-08-12 | 16991999 | FABRICATION METHOD OF SUBSTRATE HAVING ELECTRICAL INTERCONNECTION STRUCTURES | Siliconware Precision Industries Co., Ltd. | Patented Case | 2024-02-27 | 11913121 | US20200370184A1 | Po-Yi Wu Chun-Hung Lu | Taiwan Taiwan | TRINH, MINH N |
| 2020-07-30 | 16943344 | ELECTRONIC DEVICE, ELECTRONIC PACKAGE AND PACKAGING SUBSTRATE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-09-06 | 11437325 | US20210358851A1 | Ho-Chuan Lin Hsiu-Fang Chien Chih-Yuan Shih Tsung-Li Lin | Taiwan Taiwan Taiwan Taiwan | JANG, BO BIN |
| 2020-07-16 | 16931180 | ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-12-20 | 11532568 | US20210375783A1 | Chih-Hsien Chiu Wen-Jung Tsai Yu-Wei Yeh Tsung-Hsien Tsai Chi-Liang Shih Sheng-Ming Yang Ping-Hung Liao | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | FAN, SU JYA |
| 2020-07-14 | 16928289 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-08-24 | 11101566 | US20200343641A1 | Han-Hung Chen Chun-Yi Huang Chang-Fu Lin Rung-Jeng Lin Kuo-Hua Yu | Taiwan Taiwan Taiwan Taiwan Taiwan | NGUYEN, HOANG V |
| 2020-07-07 | 16922169 | ELECTRONIC PACKAGE, MANUFACTURING METHOD THEREOF AND CONDUCTIVE STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-08-09 | 11410954 | US20210320076A1 | Yu-Lung Huang Chee-Key Chung Chang-Fu Lin Yuan-Hung Hsu | Taiwan Taiwan Taiwan Taiwan | OWENS, DOUGLAS W |
| 2020-07-02 | 16919433 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2022-03-29 | 11289346 | US20200335447A1 | Chen-Yu Huang Chee-Key Chung Chang-Fu Lin Kong-Toon Ng Rui-Feng Tai Bo-Hao Ma | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | HU, SHOUXIANG |
| 2020-06-23 | 16909043 | ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2021-07-20 | 11069661 | Wei-Jhen Chen Yu-Lung Huang Chee-Key Chung Chang-Fu Lin Yuan-Hung Hsu | Taiwan Taiwan Taiwan Taiwan Taiwan | NGUYEN, DAO H | |
| 2020-06-08 | 16895461 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2021-11-02 | 11164755 | US20210343546A1 | Yung-Ta Li Yi-Chian Liao Kong-Toon Ng Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan | HARRISTON, WILLIAM A |
| 2020-06-02 | 16890128 | PACKAGING STRUCTURE AND METHOD FOR FABRICATING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-01-25 | 11233324 | US20210328339A1 | Wen-Jung Tsai Chih-Hsien Chiu | Taiwan Taiwan | WILSON, ALLAN R |
| 2020-05-19 | 16878250 | ELECTRONIC PACKAGE HAVING ANTENNA FUNCTION AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2021-12-07 | 11195808 | US20210320073A1 | Chih-Hsien Chiu Wen-Jung Tsai | Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2020-05-15 | 16875240 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2022-01-18 | 11227842 | US20200350261A1 | Po-Hao Wang Chang-Fu Lin Chun-Tang Lin Bo-Hao Chang | Taiwan Taiwan Taiwan Taiwan | TRAN, THANH Y |
| 2020-05-12 | 16872740 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-10-25 | 11482470 | US20210287962A1 | Yu-Lung Huang Chee-Key Chung Chang-Fu Lin Yuan-Hung Hsu | Taiwan Taiwan Taiwan Taiwan | JEAN BAPTISTE, WILNER |
| 2020-05-06 | 16868038 | ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2022-12-13 | 11527472 | US20210305148A1 | Cho-Hsin Chang Hao-Ju Fang Ting-Wei Chi Te-Fang Chu | Taiwan Taiwan Taiwan Taiwan | JANG, BO BIN |
| 2020-05-06 | 16867937 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-01-23 | 11881459 | US20210082837A1 | Yu-Lung Huang Chee-Key Chung Yuan-Hung Hsu Chi-Jen Chen | Taiwan Taiwan Taiwan Taiwan | AU, BAC H |
| 2020-04-29 | 16862024 | METHOD FOR MANUFACTURING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-08-03 | 11081415 | US20200258802A1 | Chieh-Lung Lai Cheng-Yi Chen Chun-Hung Lu Mao-Hua Yeh | Taiwan Taiwan Taiwan Taiwan | CHANG, JAY C |
| 2020-04-23 | 16856259 | PACKAGE STACK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2022-11-29 | 11516925 | US20200258871A1 | Han-Hung Chen Yuan-Hung Hsu Chang-Fu Lin Rung-Jeng Lin Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | ZARNEKE, DAVID A |
| 2020-04-08 | 16843386 | TEST SYSTEM | Siliconware Precision Industries Co., Ltd. | Patented Case | 2020-11-17 | 10840965 | US20200304165A1 | Bo-Siang Fang Kuan-Ta Chen Ying-Wei Lu Chia-Chu Lai Cheng-Tsai Hsieh | Taiwan Taiwan Taiwan Taiwan Taiwan | PHAM, TUAN |
| 2020-04-01 | 16837470 | METHOD FOR FABRICATING ELECTRONIC PACKAGE WITH CONDUCTIVE PILLARS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-02-09 | 10916526 | US20200227390A1 | Chih-Hsien Chiu Chia-Yang Chen Chih-Chiang He | Taiwan Taiwan Taiwan | HUYNH, ANDY |
| 2020-03-17 | 16821095 | METHOD FOR FABRICATING AN ENCAPSULATED ELECTRONIC PACKAGE USING A SUPPORTING PLATE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2021-12-07 | 11195812 | US20210175196A1 | Hsin-Yi Liao Cheng-Kai Chang Bo-Hao Ma Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan | ARORA, AJAY |
| 2020-03-12 | 16817001 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-12-21 | 11205644 | US20200212019A1 | Chi-Rui Wu Fu-Tang Huang Chia-Cheng Chen Chun-Hsien Lin Hsuan-Hao Mi Yu-Cheng Pai | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | FERNANDES, ERROL V |
| 2020-01-23 | 16750459 | METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2022-10-18 | 11476572 | US20200161756A1 | Chih-Yuan Shih Chih-Hsien Chiu Yueh-Chiung Chang Tsung-Li Lin Chi-Pin Tsai Chien-Cheng Lin Tsung-Hsien Tsai Heng-Cheng Chu Ming-Fan Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | WRIGHT, TUCKER J |
| 2020-01-14 | 16742040 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUCTOR CHIPS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2021-08-24 | 11101235 | US20200152591A1 | Lu-Yi Chen | Taiwan | CAMPBELL, SHAUN M |
| 2020-01-06 | 16734612 | ELECTRONIC PACKAGE WITH MULTIPLE ELECTRONIC COMPONENTS SPACED APART BY GROOVES | Siliconware Precision Industries Co., Ltd. | Patented Case | 2022-07-26 | 11398413 | US20210074603A1 | Hong-Da Chang Chun-Chang Ting Chi-Jen Chen | Taiwan Taiwan Taiwan | ARORA, AJAY |