SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
118 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2024-11-15: Application 18948708; Invention TEST BASE CLEANING LINE AND METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2024-07-10: Application 18769067; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MODULE AND MANUFACTURING METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2024-06-03: Application 18732009; Invention METHOD FOR FABRICATING ELECTRONIC PACKAGE; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2024-05-10: Application 18660845; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2024-11-15 | 18948708 | TEST BASE CLEANING LINE AND METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-07-21 | 12686039 | US20260070097A1 | Hsiang-Yun HUNG Yi-Ren CHEN Chun-Yu HSIEH Ping-Lin CHANG | Taiwan Taiwan Taiwan Taiwan | MARKOFF, ALEXANDER |
| 2024-07-10 | 18769067 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MODULE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-10-07 | 12438266 | US20240364001A1 | Shao-Tzu TANG Chih-Hsien CHIU Wen-Jung TSAI Ko-Wei CHANG Chia-Chu LAI | Taiwan Taiwan Taiwan Taiwan Taiwan | LEE, SEUNG H |
| 2024-06-03 | 18732009 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-08-19 | 12394636 | US20240321591A1 | Shu-Chi CHANG Wei-Ping WANG Hsien-Lung HSIAO Kaun-I CHENG | Taiwan Taiwan Taiwan Taiwan | JEFFERSON, QUOVAUNDA |
| 2024-05-10 | 18660845 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-06-30 | 12672547 | US20240297126A1 | Chih-Hsien CHIU Wen-Jung TSAI Chien-Cheng LIN Ko-Wei CHANG Yu-Wei YEH Shun-Yu CHIEN Chia-Yang CHEN | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | NELSON, JACOB THEODORE |
| 2024-05-09 | 18659692 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-05-06 | 12293952 | US20240290675A1 | Ho-Chuan LIN Min-Han CHUANG Chia-Chu LAI | Taiwan Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2024-05-06 | 18655822 | ELECTRONIC PACKAGE COMPRISING CONDUCTIVE LAYER CONNECTED ELECTRODE PAD THROUGH ELECTRONIC COMPONENT | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-07-22 | 12368081 | US20240290674A1 | Ho-Chuan LIN Min-Han CHUANG Chia-Chu LAI | Taiwan Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2024-04-24 | 18644953 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-09-09 | 12412820 | US20240290701A1 | Yi-Min FU Chi-Ching HO Cheng-Yu KANG Yu-Po WANG | Taiwan Taiwan Taiwan Taiwan | PHAM, LONG |
| 2024-04-24 | 18644937 | ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-07-15 | 12362263 | US20240282674A1 | Pin-Jing SU Cheng-Kai CHANG | Taiwan Taiwan | SENGDARA, VONGSAVANH |
| 2024-04-23 | 18643424 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-09-09 | 12412819 | US20240274519A1 | Yi-Min FU Chi-Ching HO Cheng-Yu KANG Yu-Po WANG | Taiwan Taiwan Taiwan Taiwan | PHAM, LONG |
| 2024-03-18 | 18608686 | ELECTRICAL DETECTION METHOD | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-03-31 | 12590993 | US20250147071A1 | Chun-Yi WU Cheng-Tsai HSIEH Cheng-Shao CHEN Meng-Chieh LIAO Yu-Hsiang NIEN | Taiwan Taiwan Taiwan Taiwan Taiwan | NGUYEN, VINH P |
| 2024-03-18 | 18607815 | ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE POSTS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2025-02-11 | 12224255 | US20240321784A1 | Chih-Hsien Chiu Wen-Jung Tsai | Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2024-03-12 | 18602396 | ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-03-18 | 12255165 | US20240321798A1 | Chi-Ren Chen Po-Yung Chang Pei-Geng Weng Yuan-Hung Hsu Chang-Fu Lin Don-Son Jiang | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | CAO, PHAT X |
| 2024-02-26 | 18587276 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-06-23 | 12666986 | US20250132241A1 | Chung-Chih YEN Kuo-Hui WAN Chun-Chu LAI | Taiwan Taiwan Taiwan | HO, TU TU V |
| 2024-02-02 | 18430962 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-06-09 | 12650567 | US20250102750A1 | Shuai-Lin LIU Nai-Hao KAO Yu-Po WANG | Taiwan Taiwan Taiwan | TAVLYKAEV, ROBERT FUATOVICH |
| 2024-01-16 | 18413887 | Electronic Package Including Electronic Structure and Electronic Body and Manufacturing Method Thereof | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-04-22 | 12283560 | US20240162180A1 | Feng Kao Lung-Yuan Wang | Taiwan Taiwan | MAZUMDER, DIDARUL A |