SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
1 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2015-03-10: Application 14643444; Invention FABRICATION METHOD OF PACKAGING SUBSTRATE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2015-03-10 | 14643444 | FABRICATION METHOD OF PACKAGING SUBSTRATE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-10-20 | 9165789 | US20150187603A1 | Chi-Ching Ho Yu-Chih Yu Ying-Chou Tsai | Taiwan Taiwan Taiwan | LE, DUNG ANH |