SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
35 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2013-12-30: Application 14143700; Invention SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF; Applicant Siliconware Precision Industries Co., Ltd; Status Patented Case.
- 2013-12-16: Application 14107446; Invention ELECTRONIC PACKAGE STRUCTURE; Applicant Siliconware Precision Industries Co., Ltd; Status Patented Case.
- 2013-12-04: Application 14096272; Invention METHOD FOR FABRICATING QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE; Applicant Siliconware Precision Industries Co., Ltd.; Status Patented Case.
- 2013-11-26: Application 14090787; Invention MULTI BANDWIDTH BALUN AND CIRCUIT STRUCTURE THEREOF; Applicant Siliconware Precision Industries Co., Ltd; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2013-12-30 | 14143700 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd | Patented Case | 2015-07-14 | 9082723 | US20150155250A1 | Tzu-Chieh Chen Shih-Chao Chiu Chia-Cheng Chen | Taiwan Taiwan Taiwan | PATTON, PAUL E |
| 2013-12-16 | 14107446 | ELECTRONIC PACKAGE STRUCTURE | Siliconware Precision Industries Co., Ltd | Patented Case | 2020-03-10 | 10587037 | US20140210672A1 | Chih-Hsien Chiu Heng-Cheng Chu Chien-Cheng Lin Tsung-Hsien Tsai Chao-Ya Yang Yude Chu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | HOLECEK, PATRICK R |
| 2013-12-04 | 14096272 | METHOD FOR FABRICATING QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2014-09-16 | 8835225 | US20140162409A1 | Fu-Di Tang Ching-Chiuan Wei Yung-Chih Lin | Taiwan Taiwan Taiwan | NGUYEN, THANH T |
| 2013-11-26 | 14090787 | MULTI BANDWIDTH BALUN AND CIRCUIT STRUCTURE THEREOF | Siliconware Precision Industries Co., Ltd | Patented Case | 2016-03-08 | 9281557 | US20140320374A1 | Chia-Chu Lai Min-Han Chuang Bo-Shiang Fang Ho-Chuan Lin Li-Fang Lin | Taiwan Taiwan Taiwan Taiwan Taiwan | HO, TAN |
| 2013-11-22 | 14087554 | METHOD OF MANUFACTURING THE SAME SEMICONDUCTOR PACKAGE | Siliconware Precision industries Co., Ltd | Patented Case | 2016-05-10 | 9337250 | US20140203395A1 | Tsung-Hsien Tsai Heng-Cheng Chu Chien-Cheng Lin Chih-Hsien Chiu Hsin-Lung Chung Yude Chu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | RAHIM, NILUFA |
| 2013-11-21 | 14086142 | METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE WITH CONNECTING PADS TOP AND BOTTOM SURFACES OF CARRIER | Siliconware Precision Industries Co., Ltd | Patented Case | 2015-09-08 | 9130064 | US20140080264A1 | Chang-Yueh Chan Chih-Ming Huang Chun-Yuan Li Chih-Hsin Lai | Taiwan Taiwan Taiwan Taiwan | HENRY, CALEB E |
| 2013-11-21 | 14086135 | FABRICATION METHOD OF CARRIER-FREE SEMICONDUCTOR PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD | Patented Case | 2015-02-24 | 8962396 | US20140080265A1 | Ching-Hua Chen Heng-Cheng Chu Hsin-Lung Chung Chih-Hsien Chiu Chia-Yang Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | YUSHIN, NIKOLAY K |
| 2013-11-21 | 14085981 | METHOD FOR FABRICATING WIRE BONDING STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD | Patented Case | 2016-03-22 | 9289846 | US20150028081A1 | Wei-Sheng Lin Lung-Tang Hung Meng-Hung Yeh Zhi-Lun Hsieh Yude Chu | Taiwan Taiwan Taiwan Taiwan Taiwan | STONER, KILEY SHAWN |
| 2013-11-20 | 14085168 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2014-09-09 | 8828796 | Chieh-Yuan Chi Wei-Yu Chen Hung-Wen Liu Yan-Heng Chen Hsi-Chang Hsu | Taiwan Taiwan Taiwan Taiwan Taiwan | TRINH, HOA B | |
| 2013-11-07 | 14074165 | METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-09-29 | 9147668 | US20150064850A1 | Chi-Tung Yeh Chun-Tang Lin | Taiwan Taiwan | PHAM, THANHHA S |
| 2013-11-07 | 14074148 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-12-13 | 9520304 | US20150041969A1 | Hong-Da Chang Yi-Che Lai Chi-Hsin Chiu Shih-Kuang Chiu | Taiwan Taiwan Taiwan Taiwan | AHMED, SHAHED |
| 2013-10-17 | 14056230 | SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-11-22 | 9502333 | US20140252603A1 | Meng-Tsung Lee Yi-Che Lai Shih-Kuang Chiu | Taiwan Taiwan Taiwan | DINKE, BITEW A |
| 2013-10-02 | 14044122 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-08-01 | 9720013 | US20140118019A1 | Pin-Cheng Huang Yi-Che Lai | Taiwan Taiwan | NGUYEN, VINH P |
| 2013-08-29 | 14013420 | SEMICONDUCTOR PACKAGE HAVING EMBEDDED SEMICONDUCTOR ELEMENTS | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-11-03 | 9177859 | US20140332976A1 | Yan-Heng Chen Chun-Tang Lin Yan-Yi Liao Hung-Wen Liu Chieh-Yuan Chi Hsi-Chang Hsu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | PHAM, THANH V |
| 2013-08-20 | 13971237 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-06-07 | 9362245 | US20140327131A1 | Chun-Wei Yeh Chun-Hsien Shen Hsiu-Jung Li Ya-Yi Lai Fu-Tang Huang | Taiwan Taiwan Taiwan Taiwan Taiwan | ARROYO, TERESA M |
| 2013-08-20 | 13971189 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-11-22 | 9502377 | US20140353850A1 | Chih-Hsien Chiu Tsung-Hsien Tsai Chao-Ya Yang Chia-Yang Chen Chih-Ming Cheng Yude Chu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | MUSE, ISMAIL A |
| 2013-08-20 | 13971136 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd | Patented Case | 2015-05-12 | 9029203 | US20130344661A1 | Pang-Chun Lin Yueh-Ying Tsai Yong-Liang Chen | Taiwan Taiwan Taiwan | DOAN, THERESA T |
| 2013-08-12 | 13964465 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2014-11-25 | 8895367 | US20130330883A1 | Jung-Pang Huang Hui-Min Huang Kuan-Wei Chuang Chun-Tang Lin Yih-Jenn Jiang | Taiwan Taiwan Taiwan Taiwan Taiwan | NGUYEN, THINH T |
| 2013-08-06 | 13960064 | MULTI-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-04-05 | 9305885 | US20140231972A1 | Tai-Tsung Hsu Cheng-Yu Chiang Miao-Wen Chen Wen-Jung Chiang Hsin-Hung Lee | Taiwan Taiwan Taiwan Taiwan Taiwan | RAHMAN, MOIN M |
| 2013-06-20 | 13922904 | ELECTRONIC DEVICE AND PACKAGE STRUCTURE THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-03-17 | 8981540 | US20140225241A1 | Cheng-Yu Chiang Wen-Jung Chiang Hsing-Hung Lee | Taiwan Taiwan Taiwan | CLARK, JASMINE JHIHAN B |
| 2013-06-20 | 13922858 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-04-19 | 9318354 | US20140284803A1 | Pang-Chun Lin Xie-Ren Cheng | Taiwan Taiwan | HARRISTON, WILLIAM A |
| 2013-06-20 | 13922828 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2017-09-05 | 9754898 | US20140084484A1 | Mu-Hsuan Chan Wan-Ting Chen Chun-Tang Lin Yi-Che Lai | Taiwan Taiwan Taiwan Taiwan | HARRISTON, WILLIAM A |
| 2013-06-20 | 13922798 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-04-26 | 9324582 | US20140264928A1 | Chun-Tang Lin Yi-Che Lai | Taiwan Taiwan | HARRISTON, WILLIAM A |
| 2013-06-17 | 13919176 | SHIELD, PACKAGE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SHIELD AND FABRICATION METHOD OF THE SEMICONDUCTOR PACKAGE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2016-02-09 | 9257394 | US20140312473A1 | Kuang-Neng Chung Hsin-Lung Chung Tien-Chung Huang Tsung-Hsien Hsu | Taiwan Taiwan Taiwan Taiwan | SCHOENHOLTZ, JOSEPH |
| 2013-05-30 | 13905703 | ELECTRO-OPTICAL MODULE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-06-16 | 9058971 | US20140192832A1 | Chih-Yuan Shih Shih-Liang Peng Jung-Pin Huang Chin-Yu Ku Hsien-Wen Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | NGUYEN, NIKI HOANG |
| 2013-05-15 | 13894687 | INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2015-07-07 | 9076796 | US20140217605A1 | Chun-Hung Lin Chun-Hung Lu Guang-Hwa Ma Hsiao-Chun Huang Kuang-Hsin Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | POTTER, ROY KARL |
| 2013-05-02 | 13875550 | DUPLEXER, CIRCUIT STRUCTURE THEREOF AND RF TRANSCEIVER APPARATUS COMPRISING THE DUPLEXER | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2016-11-22 | 9503043 | US20140204806A1 | Min-Han Chuang Chia-Chu Lai Bo-Shiang Fang Ho-Chuan Lin Yen-Yu Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | PATEL, RAKESH BHASKARBHAI |
| 2013-04-29 | 13872468 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2015-07-21 | 9087780 | US20140027926A1 | Wan-Ting Chen Mu-Hsuan Chan Yi-Chian Liao Chun-Tang Lin Yi-Che Lai | Taiwan Taiwan Taiwan Taiwan Taiwan | HO, TU TU V |
| 2013-04-09 | 13859147 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE HAVING A DEFORMED SUPPORTING PORTION | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2016-02-09 | 9257311 | US20140134805A1 | Shih-Yao Liu Yueh-Ying Tsai Yong-Liang Chen | Taiwan Taiwan Taiwan | NGUYEN, DILINH P |
| 2013-03-18 | 13845698 | METHOD OF TESTING A SEMICONDUCTOR PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2015-03-24 | 8987012 | US20140127838A1 | Pin-Cheng Huang Chun-Tang Lin Wen-Tsung Tseng Yi-Che Lai | Taiwan Taiwan Taiwan Taiwan | SWANSON, WALTER H |
| 2013-03-15 | 13834787 | SEMICONDUCTOR PACKAGE STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2015-03-17 | 8981575 | US20130200508A1 | Pang-Chun Lin Chun-Yuan Li Chien-Ping Huang Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan | PAREKH, NITIN |
| 2013-03-15 | 13834684 | FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2014-05-06 | 8716070 | US20130203200A1 | Chi-Hsin Chiu Chih-Ming Huang Chang-Yueh Chan Hsin-Yi Liao Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan Taiwan | THOMAS, TONIAE M |
| 2013-02-27 | 13779077 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2014-05-06 | 8716861 | US20130161802A1 | Pang-Chun Lin Chun-Yuan Li Fu-Di Tang Chien-Ping Huang Chun-Chi Ke | Taiwan Taiwan Taiwan Taiwan Taiwan | DOAN, THERESA T |
| 2013-01-30 | 13753930 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2015-02-10 | 8952528 | US20140138791A1 | Chien-Feng Chan Chun-Tang Lin Yi Che Lai | Taiwan Taiwan Taiwan | LEBENTRITT, MICHAEL |
| 2013-01-30 | 13753882 | SEMICONDUCTOR SUBSTRATE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2017-07-04 | 9698090 | US20140124950A1 | Bo-Shiang Fang Ho-Chuan Lin Chia-Chu Lai Min-Han Chuang Li-Fang Lin | Taiwan Taiwan Taiwan Taiwan Taiwan | YASMEEN, NISHATH |