SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
37 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2023-12-12: Application 18537638; Invention ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2023-11-13: Application 18389105; Invention ELECTRONIC STRUCTURE; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2023-10-04: Application 18376652; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2023-09-11: Application 18464855; Invention CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRATE, AND METHODS FOR MANUFACTURING THE SAME; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2023-12-12 | 18537638 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-01-21 | 12205906 | US20240162169A1 | Yu-Lung Huang Chee-Key Chung Yuan-Hung Hsu Chi-Jen Chen | Taiwan Taiwan Taiwan Taiwan | AU, BAC H |
| 2023-11-13 | 18389105 | ELECTRONIC STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-10-07 | 12438079 | US20240162140A1 | Feng Kao Lung-Yuan Wang | Taiwan Taiwan | HOQUE, MOHAMMAD M |
| 2023-10-04 | 18376652 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-04-15 | 12278189 | US20240038670A1 | Yu-Lung Huang Chih-Ming Huang Kuo-Hua Yu Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan | CLINTON, EVAN GARRETT |
| 2023-09-11 | 18464855 | CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRATE, AND METHODS FOR MANUFACTURING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-10-22 | 12125828 | US20230420420A1 | Chi-Ching HO Bo-Hao MA Yu-Ting XUE Ching-Hung TSENG Guan-Hua LU Hong-Da CHANG | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | RAHMAN, MOHAMMAD A |
| 2023-08-30 | 18458452 | CARRIER STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-01-13 | 12526912 | US20240407079A1 | Chien-Sheng CHEN Chia-Chu LAI Ho-Chuan LIN | Taiwan Taiwan Taiwan | NORRIS, JEREMY C |
| 2023-08-17 | 18235079 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-03-18 | 12255182 | US20230395571A1 | Meng-Huan Chia Yih-Jenn Jiang Chang-Fu Lin Don-Son Jiang | Taiwan Taiwan Taiwan Taiwan | LE, THAO P |
| 2023-08-16 | 18234695 | ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC PACKAGE HAVING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-09-24 | 12100648 | US20230386992A1 | Ho-Chuan Lin Chia-Chu Lai Min-Han Chuang | Taiwan Taiwan Taiwan | LEE, EUGENE |
| 2023-08-11 | 18448515 | ELECTRONIC PACKAGE WITH IMPROVED HEAT DISSIPATING AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-09-22 | 12745630 | US20240421026A1 | Chiu-Ling CHEN Shuai-Lin LIU Pin-Jing SU Yi-Min FU Lung-Yuan WANG | Taiwan Taiwan Taiwan Taiwan Taiwan | RAMALLO, GUSTAVO G |
| 2023-08-11 | 18448323 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-03-31 | 12593698 | US20240379590A1 | Chia-Chu LAI Yi-Min FU Chien-Sheng CHEN | Taiwan Taiwan Taiwan | GUMEDZOE, PENIEL M |
| 2023-07-24 | 18357596 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-07-14 | 12685155 | US20240363577A1 | Pin-Jing SU Wen-Yu TENG Liang-Yi HUNG Chia-Cheng CHEN Yu-Po WANG | Taiwan Taiwan Taiwan Taiwan Taiwan | GUMEDZOE, PENIEL M |
| 2023-07-18 | 18223221 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-09-24 | 12100641 | US20230360997A1 | Chih-Hsien Chiu Siang-Yu Lin Wen-Jung Tsai Chia-Yang Chen Chien-Cheng Lin | Taiwan Taiwan Taiwan Taiwan Taiwan | GUMEDZOE, PENIEL M |
| 2023-07-14 | 18352952 | ELECTRONIC PACKAGE HAVING A CHIP WITH A TRENCH IN THE SURFACE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-06-30 | 12672553 | US20240363545A1 | Che-Yu LEE Chi-Ching HO Chao-Chiang PU Yi-Min FU Po-Yuan SU | Taiwan Taiwan Taiwan Taiwan Taiwan | CHAMBLISS, ALONZO |
| 2023-07-13 | 18351770 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-11-11 | 12469774 | US20240332149A1 | Yuan-Chang NI Yu-Cheng PAI Yuan-Ping YEH Chan-Yu YEH Meng-Jou HE | Taiwan Taiwan Taiwan Taiwan Taiwan | CHEN, YU |
| 2023-06-30 | 18345426 | ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-05-26 | 12642114 | US20240312889A1 | Fang-Lin TSAI Wei-Son TSAI Kun-Yuan LUO Pei-Geng WENG Ching-Hung TSENG | Taiwan Taiwan Taiwan Taiwan Taiwan | ESKRIDGE, CORY W |
| 2023-06-28 | 18343544 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | Siliconware Precision Industries Co., Ltd. | Patented Case | 2024-07-09 | 12033868 | US20230343603A1 | Mr. Shu-Chi Chang Wei-Ping Wang Hsien-Lung Hsiao Kaun-I Cheng | Taiwan Taiwan Taiwan Taiwan | JEFFERSON, QUOVAUNDA |
| 2023-06-27 | 18215113 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE COMPRISING A WIRE WITHIN AN ELECTRONIC COMPONENT | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-06-18 | 12014967 | US20230343665A1 | Ho-Chuan Lin Min-Han Chuang Chia-Chu Lai | Taiwan Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2023-06-27 | 18215107 | --ELECTRONIC PACKAGE COMPRISING MULTIPLE WIRES INSIDE AN ELECTRONIC COMPONENT-- | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-08-20 | 12068211 | US20230343664A1 | Ho-Chuan Lin Min-Han Chuang Chia-Chu Lai | Taiwan Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2023-06-27 | 18214969 | --ELECTRONIC PACKAGE COMPRISING WIRE INSIDE AN ELECTRONIC COMPONENT-- | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-09-24 | 12100633 | US20230343663A1 | Ho-Chuan Lin Min-Han Chuang Chia-Chu Lai | Taiwan Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2023-06-26 | 18341529 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-12-16 | 12500145 | US20240290691A1 | Min-Han CHUANG Ho-Chuan LIN Chia-Chu LAI | Taiwan Taiwan Taiwan | DOAN, THERESA T |
| 2023-06-14 | 18334434 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-01-20 | 12532745 | US20240290728A1 | Wen-Jung TSAI Chih-Hsien CHIU Chien-Cheng LIN Ming-Fan TSAI Cheng-You JENG Hui-Jing CHANG | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | FERNANDES, ERROL V |
| 2023-06-01 | 18327097 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-07-14 | 12685211 | US20240282655A1 | Fang-Lin TSAI Wei-Son TSAI Kun-Yuan LUO Pei-Geng WENG Sheng-Hua YANG | Taiwan Taiwan Taiwan Taiwan Taiwan | PRASAD, NEIL R |
| 2023-05-30 | 18325846 | ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-05-05 | 12622298 | US20240282689A1 | Chan-Yu YEH Yu-Cheng PAI Yuan-Ping YEH Yuan-Chang NI Meng-Jou HE | Taiwan Taiwan Taiwan Taiwan Taiwan | GEYER, SCOTT B |
| 2023-05-25 | 18323741 | WORKING SYSTEM FOR SEMICONDUCTOR PACKAGING PROCESS AND OPERATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-04-21 | 12610779 | US20240266197A1 | Tang-Hsin KUO Chin-Chih HSIAO Hung-Wen CHIEN I HSU | Taiwan Taiwan Taiwan Taiwan | MYERS, GLENN F |
| 2023-05-04 | 18143247 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-08-06 | 12057618 | US20230275337A1 | Chung-Yu Ke Chia-Chu Lai Liang-Pin Chen | Taiwan Taiwan Taiwan | KIM, SEOKJIN |
| 2023-05-02 | 18310985 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-10-21 | 12451416 | US20240222250A1 | Jun-Hao FENG You-Chen LIN | Taiwan Taiwan | MAIGA, SIDI MOHAMED |
| 2023-05-02 | 18310644 | ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-09-08 | 12733548 | US20240266335A1 | Huan-Shiang LI Yih-Jenn JIANG Cheng-Kai CHANG Wei-Son TSAI Yi-Chieh WANG | Taiwan Taiwan Taiwan Taiwan Taiwan | MENZ, LAURA MARY |
| 2023-05-02 | 18310629 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-09-08 | 12733504 | US20240234335A1 | Yen-Yu CHU Tsung-Yu HUANG Kuo-Hua TSENG Tsung-Xin CHIEN Chang-Ku-Yuan SIE | Taiwan Taiwan Taiwan Taiwan Taiwan | CHANG, JAY C |
| 2023-05-01 | 18310428 | ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-07-08 | 12354885 | US20240258121A1 | Yi-Ling CHEN Kuan-Wei CHUANG | Taiwan Taiwan | NG, SHERMAN |
| 2023-04-28 | 18309756 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-12-24 | 12176327 | US20230268328A1 | Kong-Toon Ng Hung-Ho Lee Chee-Key Chung Chang-Fu LIN Chi-Hsin Chiu | Taiwan Taiwan Taiwan Taiwan Taiwan | HO, TU TU V |
| 2023-04-11 | 18298450 | ELECTRONIC PACKAGE AND SHIELDING PART INCLUDING SEMICONDUCTOR BLOCK AND MAGNETIZED LAYER | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-07-14 | 12685173 | US20240203900A1 | Chih-Hsien CHIU Wen-Jung TSAI Ko-Wei CHANG Jyun-Hao YANG Chia-Yang CHEN | Taiwan Taiwan Taiwan Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2023-02-24 | 18173883 | ELECTRONIC PACKAGE INCLUDING AN INTERPOSER STACKED ON AN ELECTRONIC ELEMENT AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-12-16 | 12500131 | US20240170355A1 | Chih-Hsien CHIU Wen-Jung TSAI Ko-Wei CHANG Chien-Cheng LIN | Taiwan Taiwan Taiwan Taiwan | NGUYEN, KHIEM D |
| 2023-02-13 | 18109120 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-10-01 | 12107055 | US20230187382A1 | Chih-Hsun Hsu Chi-Jen Chen Hsi-Chang Hsu Yuan-Hung Hsu Rui-Feng Tai Don-Son Jiang | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | LE, THAO P |
| 2023-02-06 | 18165044 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-12-16 | 12500181 | US20240145403A1 | Chih-Hsien CHIU Wen-Jung TSAI Chih-Chiang HE Ko-Wei CHANG Chia-Yang CHEN | Taiwan Taiwan Taiwan Taiwan Taiwan | DINKE, BITEW A |
| 2023-01-30 | 18103196 | ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE POSTS | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-04-30 | 11973043 | US20230245986A1 | Chih-Hsien Chiu Wen-Jung Tsai | Taiwan Taiwan | MAZUMDER, DIDARUL A |
| 2023-01-17 | 18155337 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-04-28 | 12616067 | US20240145455A1 | Meng-Jie LEE Chih-Nan LIN Ci-Hong YAN Nai-Hao KAO | Taiwan Taiwan Taiwan Taiwan | MUNOZ, ANDRES F |
| 2023-01-17 | 18097965 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-05-14 | 11984412 | US20230154873A1 | Chih-Hsien Chiu Ko-Wei CHANG | Taiwan Taiwan | PHAM, LONG |
| 2023-01-17 | 18097847 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-02-18 | 12230590 | US20230154872A1 | Chih-Hsien Chiu Ko-Wei CHANG | Taiwan Taiwan | PHAM, LONG |