SILICONWARE PRECISION INDUSTRIES CO LTD Active Patents
43 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2022-12-30: Application 18148440; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2022-12-27: Application 18146924; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2022-12-22: Application 18145824; Invention ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE STRUCTURE; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
- 2022-12-08: Application 18063442; Invention ELECTRONIC PACKAGE; Applicant SILICONWARE PRECISION INDUSTRIES CO., LTD.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2022-12-30 | 18148440 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-03-10 | 12575420 | US20240153884A1 | Yi-Min FU Hung-Kai WANG Chi-Ching HO Yih-Jenn JIANG Yu-Po WANG | Taiwan Taiwan Taiwan Taiwan Taiwan | PHAM, LONG |
| 2022-12-27 | 18146924 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-06-02 | 12646826 | US20240145908A1 | Yi-Chun LAI Hsuan-Jen WANG Rung-Jeng LIN | Taiwan Taiwan Taiwan | DUONG, DIEU HIEN |
| 2022-12-22 | 18145824 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-11-26 | 12154848 | US20240145372A1 | Chia-Wen TSAO Wen-Chen HSIEH Yi-Lin TSAI Hsiu-Fang CHIEN | United States United States United States Taiwan | NG, SHERMAN |
| 2022-12-08 | 18063442 | ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-11-18 | 12476229 | US20240128249A1 | Chih-Hsien CHIU Wen-Jung TSAI Chi-Ching HO | Taiwan Taiwan Taiwan | PHAM, LONG |
| 2022-12-08 | 18063426 | CARRIER STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-04-28 | 12616034 | US20240145398A1 | Cheng-Liang HSU Wan-Rou CHEN Hsin-Yin CHANG Tsung-Li LIN Hsiu-Jung LI Chiu-Lien LI Fu-Quan XU Yi-Wen LIU Chih-Chieh SUN | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | TOBERGTE, NICHOLAS J |
| 2022-12-08 | 18063413 | SEMICONDUCTOR PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-09-16 | 12417983 | US20240088054A1 | Shu-Ting LAI Chiu-Lien LI Che-Min SU Chun-Huan HUNG Mu-Hung HSIEH Cheng-Han YAO Fajanilan Darcyjo Directo Cheng-Liang HSU | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | HARRISTON, WILLIAM A |
| 2022-12-08 | 18063377 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-05-12 | 12628673 | US20230230912A1 | Wan-Rou CHEN Yi-Wen LIU Hsiu-Jung LI Yi-Chen CHI Tsung-Li LIN | Taiwan Taiwan Taiwan Taiwan Taiwan | TYNES JR., LAWRENCE C |
| 2022-12-08 | 18063115 | ELECTRONIC STRUCTURE HAVING FIRST AND SECOND THERMAL CONDUCTIVE MATERIALS COVERING CONDUCTIVE BUMPS AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC PACKAGE HAVING ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-09-09 | 12412869 | US20240047420A1 | Yi-Ling CHEN | Taiwan | JUNG, MICHAEL YOO LIM |
| 2022-11-16 | 18056078 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-06-17 | 12334425 | US20240079301A1 | Ho-Chuan LIN Chia-Chu LAI Min-Han CHUANG | Taiwan Taiwan Taiwan | TOBERGTE, NICHOLAS J |
| 2022-11-16 | 17988286 | CHIP MATCHING SYSTEM AND METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-07-23 | 12046494 | US20230076941A1 | Wu-Hung Yen Yi-Hsien Huang Chun-Tang Lin Shu-Hua Chen Shou-Qi Chang | Taiwan Taiwan Taiwan Taiwan Taiwan | SHAMSUZZAMAN, MOHAMMED |
| 2022-11-07 | 17981763 | ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-01-13 | 12525524 | US20240047336A1 | Ching-Chih Lin Wen-Hsin Wang Chieh-Yi Hsieh Shin-Yu Wang Yi-Chien Huang Hsiu-Fang Chien | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | ARROYO, TERESA M |
| 2022-11-02 | 17979262 | CARRIER STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-02-04 | 12219693 | US20240049382A1 | Chin-Wei Hsu Jui-Kun Wang Shu-Yu Ko Fang-Wei Chang Hsiu-Fang Chien | Taiwan Taiwan Taiwan Taiwan Taiwan | AZAM, MUHAMMED |
| 2022-11-01 | 17978493 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2023-11-07 | 11810862 | US20230053125A1 | Yu-Lung Huang Chih-Ming Huang Kuo-Hua Yu Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan | CLINTON, EVAN GARRETT |
| 2022-10-27 | 17975455 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Siliconware Precision Industries Co., Ltd. | Patented Case | 2025-12-09 | 12494460 | US20240072019A1 | Chung-Yu Ke Liang-Pin Chen | Taiwan Taiwan | FERNANDES, ERROL V |
| 2022-09-29 | 17956653 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-08-12 | 12388062 | US20240047440A1 | Wen-Jung Tsai Chih-Hsien Chiu Chin-Chiang He Ko-Wei Chang Chien-Cheng Lin | Taiwan Taiwan Taiwan Taiwan Taiwan | GUMEDZOE, PENIEL M |
| 2022-09-29 | 17956566 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-08-12 | 12387993 | US20230223316A1 | Tai-Shin Renn Kuo-Hua Yu Yu-Min Lo Wei-Shen Hung | Taiwan Taiwan Taiwan Taiwan | FERNANDES, ERROL V |
| 2022-09-22 | 17950914 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-06-17 | 12334452 | US20240038685A1 | Chao-Chiang Pu Chi-Ching Ho Yi-Min Fu Yu-Po Wang Fang-Lin Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan | GUMEDZOE, PENIEL M |
| 2022-09-14 | 17944464 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-09-15 | 12740407 | US20230178451A1 | Hsin-Jou Lin Lung-Yuan Wang Feng Kao Chiu-Ling Chen | Taiwan Taiwan Taiwan Taiwan | TIVARUS, CRISTIAN ALEXANDRU |
| 2022-09-14 | 17944453 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-07-22 | 12368116 | US20230420391A1 | Feng Kao Lung-Yuan Wang | Taiwan Taiwan | GUMEDZOE, PENIEL M |
| 2022-08-29 | 17897673 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-06-02 | 12648446 | US20230402398A1 | Che-Chi Wu Chien-Tang Li | Taiwan Taiwan | PARTHASARATHY, ROHIT |
| 2022-08-29 | 17897523 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-10-07 | 12438094 | US20230253331A1 | Yi-Min Fu Chi-Ching Ho Chao-Chiang Pu Yu-Po Wang | Taiwan Taiwan Taiwan Taiwan | SYLVIA, CHRISTINA A |
| 2022-08-23 | 17893599 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-03-31 | 12593694 | US20230253342A1 | Hsiu-Fang Chien Wen-Chen Hsieh Chia-Wen Tsao Hsin-Yin Chang Ya-Ting Chi Yi-Lin Tsai | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | NORRIS, JEREMY C |
| 2022-07-18 | 17866878 | ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-01-20 | 12532766 | US20230369268A1 | Yung-Ta Li Po-Kai Huang | Taiwan Taiwan | SHAMSUZZAMAN, MOHAMMED |
| 2022-07-13 | 17863794 | ULTRASONIC DEVICE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-01-20 | 12528220 | US20230381996A1 | Yu-Lung Huang Chih-Hui Huang Cheng-Ying Hsieh Sin-Cyuan Lin Men-Yeh Chiang Chao-Lin Chang Ting-Hsu Lu | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | DO, NHAT CHIEU Q |
| 2022-07-07 | 17859291 | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-04-15 | 12278173 | US20230343692A1 | Wen-Chen Hsieh Ya-Ting Chi Chia-Wen Tsao Hsin-Yin Chang Yi-Lin Tsai Hsiu-Fang Chien | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | CLARK, JASMINE JHIHAN B |
| 2022-07-06 | 17858905 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-06-17 | 12334456 | US20230402409A1 | Chung-Yu Ke Liang-Pin Chen | Taiwan Taiwan | TYNES JR., LAWRENCE C |
| 2022-06-30 | 17854241 | ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-09-24 | 12100642 | US20220336323A1 | Yu-Lung Huang Chee-Key Chung Chang-Fu Lin Yuan-Hung Hsu | Taiwan Taiwan Taiwan Taiwan | JEAN BAPTISTE, WILNER |
| 2022-06-29 | 17853097 | ELECTRONIC PACKAGE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-05-20 | 12308308 | US20230343691A1 | Sung-Hua Chung Liang-Pin Chen | Taiwan Taiwan | HO, TU TU V |
| 2022-06-27 | 17850527 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-08-26 | 12400931 | US20230014476A1 | Yu-Lung Huang Chih-Ming Huang Kuo-Hua Yu Chang-Fu Lin | Taiwan Taiwan Taiwan Taiwan | NELSON, JACOB THEODORE |
| 2022-06-14 | 17840082 | SUBSTRATE STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-09-09 | 12414232 | US20230066456A1 | Pei-Geng Weng Fang-Lin Tsai Wei-Son Tsai Yih-Jenn Jiang | Taiwan Taiwan Taiwan Taiwan | SAWYER, STEVEN T |
| 2022-06-02 | 17831301 | METHOD FOR FABRICATING ASSEMBLE SUBSTRATE | Siliconware Precision Industries Co., Ltd. | Patented Case | 2024-10-08 | 12114427 | US20220304157A1 | Lung-Yuan WANG Wen-Liang Lien | Taiwan Taiwan | NGUYEN, DONGHAI D |
| 2022-06-01 | 17829533 | ELECTRONIC PACKAGE OF TWO VERTICALLY STACKED CHIPS WITH CHIP-TO-CHIP BUMP CONNECTIONS AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2026-01-13 | 12525505 | US20220399246A1 | Yi-Min Fu Chi-Ching Ho Yu-Po Wang | Taiwan Taiwan Taiwan | MOTT, ADAM JOSEPH |
| 2022-05-23 | 17750931 | ELECTRONIC PACKAGE HAVING MULTI-CHIP PACKAGE STRUCTURE | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-12-16 | 12500159 | US20230268262A1 | Li-Chu Chang Yuan-Hung Hsu Don-Son Jiang | Taiwan Taiwan Taiwan | LIU, MIKKA H |
| 2022-05-19 | 17748957 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MODULE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-08-20 | 12068535 | US20230282972A1 | Shao-Tzu Tang Chih-Hsien Chiu Wen-Jung Tsai Ko-Wei Chang Chia-Chu LAI | Taiwan Taiwan Taiwan Taiwan Taiwan | LEE, SEUNG H |
| 2022-05-19 | 17748920 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-12-03 | 12159821 | US20230307339A1 | Ting-Yang Chou Yih-Jenn Jiang Don-Son Jiang | Taiwan Taiwan Taiwan | FOX, BRANDON C |
| 2022-05-18 | 17747900 | Electronic package with multiple electronic components spaced apart by grooves | Siliconware Precision Industries Co., Ltd. | Patented Case | 2023-06-13 | 11676877 | US20220278013A1 | Hong-Da Chang Chun-Chang Ting Chi-Jen Chen | Taiwan Taiwan Taiwan | ARORA, AJAY |
| 2022-05-10 | 17740796 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-12-24 | 12176291 | US20230282586A1 | Chao-Chiang Pu Chi-Ching Ho Yi-Min Fu Yu-Po Wang Shuai-Lin Liu | Taiwan Taiwan Taiwan Taiwan Taiwan | MENZ, LAURA MARY |
| 2022-02-17 | 17674457 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-10-08 | 12113004 | US20230197591A1 | Chung-Yu Ke Po-Kai Huang Liang-Pin Chen | Taiwan Taiwan Taiwan | ARMAND, MARC ANTHONY |
| 2022-01-25 | 17583946 | ELECTRONIC PACKAGE, HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-09-03 | 12080618 | US20220375813A1 | Yu-Lung Huang Kuo-Hua Yu Chang-Fu Lin | Taiwan Taiwan Taiwan | TRINH, HOA B |
| 2022-01-13 | 17574944 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-01-28 | 12211776 | US20230223322A1 | Chih-Hsien Chiu Ko-Wei Chang Wen-Jung Tsai Che-Wei Yu Chia-Yang Chen | Taiwan Taiwan Taiwan Taiwan Taiwan | PHAM, LONG |
| 2022-01-10 | 17572001 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2025-01-14 | 12199047 | US20230154865A1 | Chao-Chiang Pu Chi-Ching Ho Yi-Min Fu Yu-Po Wang Po-Yuan Su | Taiwan Taiwan Taiwan Taiwan Taiwan | VALENZUELA, PATRICIA D |
| 2022-01-10 | 17571901 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-08-06 | 12057409 | US20230163082A1 | Chih-Hsien Chiu Wen-Jung Tsai Chien-Cheng Lin Ko-Wei Chang Yu-Wei Yeh Shun-Yu Chien Chia-Yang Chen | Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan Taiwan | NELSON, JACOB THEODORE |
| 2022-01-05 | 17568913 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | SILICONWARE PRECISION INDUSTRIES CO., LTD. | Patented Case | 2024-10-29 | 12132003 | US20230136541A1 | You-Chen Lin Yu-Min Lo Kuo-Hua Yu Jun-Hao Feng | Taiwan Taiwan Taiwan Taiwan | CLINTON, EVAN GARRETT |