Taiwan Semiconductor Manufacturing Company Limited Repayments Of Bonds Notes And Debentures
Taiwan Semiconductor Manufacturing Company Limited (TSM) reported Repayments Of Bonds Notes And Debentures of TWD 7.00 billion for the 12-month period ending 2024-12-31, per its 20-F filed 2025-04-17.
Financial Statements › Cash Flow › Financing Activities
ifrs-full:RepaymentsOfBondsNotesAndDebentures · last filed 2025-04-17
TWD
| Period end | Repayments Of Bonds Notes And Debentures 6 month | Repayments Of Bonds Notes And Debentures 12 month |
|---|---|---|
| 2024-12-31 | 7.00B TWD 20-F · filed 2025-04-17 | |
| 2023-12-31 | 18.10B TWD 20-F · filed 2025-04-17 | |
| 2022-12-31 | 4.40B TWD 20-F · filed 2025-04-17 | |
| 2021-12-31 | 2.60B TWD 20-F · filed 2024-04-18 | |
| 2021-06-30 | 2.60B TWD 6-K · filed 2021-10-18 | |
| 2020-12-31 | 31.80B TWD 20-F · filed 2023-04-20 | |
| 2020-06-30 | 21.60B TWD 6-K · filed 2021-10-18 | |
| 2019-12-31 | 34.90B TWD 20-F · filed 2022-04-14 | |
| 2018-12-31 | 58.02B TWD 20-F · filed 2021-04-16 | |
| 2017-12-31 | 38.10B TWD 20-F · filed 2020-04-15 | |
| 2016-12-31 | 23.47B TWD 20-F · filed 2019-04-17 |
USD
| Period end | Repayments Of Bonds Notes And Debentures 6 month | Repayments Of Bonds Notes And Debentures 12 month |
|---|---|---|
| 2024-12-31 | $213.50M 20-F · filed 2025-04-17 | |
| 2023-12-31 | $591.10M 20-F · filed 2024-04-18 | |
| 2022-12-31 | $143.20M 20-F · filed 2023-04-20 | |
| 2021-12-31 | $93.70M 20-F · filed 2022-04-14 | |
| 2021-06-30 | $93.20M 6-K · filed 2021-10-18 | |
| 2020-12-31 | $1.13B 20-F · filed 2021-04-16 | |
| 2019-12-31 | $1.17B 20-F · filed 2020-04-15 | |
| 2018-12-31 | $1.90B 20-F · filed 2019-04-17 | |
| 2017-12-31 | $1.29B 20-F · filed 2018-04-19 |