Taiwan Semiconductor Manufacturing Company Limited Dividends Paid Classified As Financing Activities
Taiwan Semiconductor Manufacturing Company Limited (TSM) reported Dividends Paid Classified As Financing Activities of TWD 363.06 billion for the 12-month period ending 2024-12-31, per its 20-F filed 2025-04-17.
Financial Statements › Cash Flow › Financing Activities
ifrs-full:DividendsPaidClassifiedAsFinancingActivities · last filed 2025-04-17
TWD
| Period end | Dividends Paid Classified As Financing Activities 6 month | Dividends Paid Classified As Financing Activities 12 month |
|---|---|---|
| 2024-12-31 | 363.06B TWD 20-F · filed 2025-04-17 | |
| 2023-12-31 | 291.72B TWD 20-F · filed 2025-04-17 | |
| 2022-12-31 | 285.23B TWD 20-F · filed 2025-04-17 | |
| 2021-12-31 | 265.79B TWD 20-F · filed 2024-04-18 | |
| 2021-06-30 | 129.65B TWD 6-K · filed 2021-10-18 | |
| 2020-12-31 | 259.30B TWD 20-F · filed 2023-04-20 | |
| 2020-06-30 | 129.65B TWD 6-K · filed 2021-10-18 | |
| 2019-12-31 | 259.30B TWD 20-F · filed 2022-04-14 | |
| 2018-12-31 | 207.44B TWD 20-F · filed 2021-04-16 | |
| 2017-12-31 | 181.51B TWD 20-F · filed 2020-04-15 | |
| 2016-12-31 | 155.58B TWD 20-F · filed 2019-04-17 | |
| 2015-12-31 | 116.68B TWD 20-F · filed 2018-04-19 |
USD
| Period end | Dividends Paid Classified As Financing Activities 6 month | Dividends Paid Classified As Financing Activities 12 month |
|---|---|---|
| 2024-12-31 | $11.07B 20-F · filed 2025-04-17 | |
| 2023-12-31 | $9.53B 20-F · filed 2024-04-18 | |
| 2022-12-31 | $9.28B 20-F · filed 2023-04-20 | |
| 2021-12-31 | $9.58B 20-F · filed 2022-04-14 | |
| 2021-06-30 | $4.65B 6-K · filed 2021-10-18 | |
| 2020-12-31 | $9.23B 20-F · filed 2021-04-16 | |
| 2019-12-31 | $8.67B 20-F · filed 2020-04-15 | |
| 2018-12-31 | $6.78B 20-F · filed 2019-04-17 | |
| 2017-12-31 | $6.12B 20-F · filed 2018-04-19 |