Taiwan Semiconductor Manufacturing Company Limited Proceeds From Issue Of Bonds Notes And Debentures
Taiwan Semiconductor Manufacturing Company Limited (TSM) reported Proceeds From Issue Of Bonds Notes And Debentures of TWD 34.30 billion for the 12-month period ending 2024-12-31, per its 20-F filed 2025-04-17.
Financial Statements › Cash Flow › Financing Activities
ifrs-full:ProceedsFromIssueOfBondsNotesAndDebentures · last filed 2025-04-17
TWD
| Period end | Proceeds From Issue Of Bonds Notes And Debentures 6 month | Proceeds From Issue Of Bonds Notes And Debentures 12 month |
|---|---|---|
| 2024-12-31 | 34.30B TWD 20-F · filed 2025-04-17 | |
| 2023-12-31 | 85.70B TWD 20-F · filed 2025-04-17 | |
| 2022-12-31 | 198.29B TWD 20-F · filed 2025-04-17 | |
| 2021-12-31 | 364.59B TWD 20-F · filed 2024-04-18 | |
| 2021-06-30 | 157.81B TWD 6-K · filed 2021-10-18 | |
| 2020-12-31 | 236.73B TWD 20-F · filed 2023-04-20 | |
| 2020-06-30 | 60.00B TWD 6-K · filed 2021-10-18 |
USD
| Period end | Proceeds From Issue Of Bonds Notes And Debentures 6 month | Proceeds From Issue Of Bonds Notes And Debentures 12 month |
|---|---|---|
| 2024-12-31 | $1.05B 20-F · filed 2025-04-17 | |
| 2023-12-31 | $2.80B 20-F · filed 2024-04-18 | |
| 2022-12-31 | $6.45B 20-F · filed 2023-04-20 | |
| 2021-12-31 | $13.14B 20-F · filed 2022-04-14 | |
| 2021-06-30 | $5.65B 6-K · filed 2021-10-18 | |
| 2020-12-31 | $8.43B 20-F · filed 2021-04-16 |