INTEGRATED SILICON SOLUTION INC Patent Applications Rejected
1 applications abandoned without a patent; the status gives the reason, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2022-04-19: Application 17723536; Invention PACKAGE STRUCTURE; Applicant Integrated Silicon Solution Inc.; Status Abandoned -- Failure to Respond to an Office Action.
| Filed | Application | Invention | Applicant | Status | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|
| 2022-04-19 | 17723536 | PACKAGE STRUCTURE | Integrated Silicon Solution Inc. | Abandoned -- Failure to Respond to an Office Action | US20220246501A1 | Cheng-Fu YU Kai-Jih SHIH Chi-Yi WU | United States United States United States | CHEN, DAVID Z |