Element Solutions Inc Active Patents
13 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2023-12-20: Application 18390072; Invention METHOD FOR IMPROVING ADHESION BETWEEN METALLIZATION LAYERS AND OZONE-ETCHED PLASTICS; Applicant MacDermid Enthone Inc.; Status Patented Case.
- 2023-12-08: Application 18568465; Invention COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING; Applicant MacDermid Enthone Inc.; Status Patented Case.
- 2023-10-31: Application 18289075; Invention Single Step Electrolytic Method of Filling Through-Holes in Printed Circuit Boards and Other Substrates; Applicant MacDermid Enthone Inc.; Status Patented Case.
- 2023-10-05: Application 18376896; Invention Stretchable Interconnects for Flexible Electronic Surfaces; Applicant Alpha Assembly Solutions Inc.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2023-12-20 | 18390072 | METHOD FOR IMPROVING ADHESION BETWEEN METALLIZATION LAYERS AND OZONE-ETCHED PLASTICS | MacDermid Enthone Inc. | Patented Case | 2026-02-03 | 12540404 | US20250207264A1 | Andreas Königshofen Almedina Fetahovic Stefan Schäfer | Germany United States Germany | LEONG, NATHAN T |
| 2023-12-08 | 18568465 | COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING | MacDermid Enthone Inc. | Patented Case | 2025-06-10 | 12325927 | US20240271307A1 | Donald Desalvo Ron Blake Carmichael Gugliotti William J. Decesare Richard A. Bellemare James Watkowski Ernest Long | China United States United States United States United States United States United States | COHEN, BRIAN W |
| 2023-10-31 | 18289075 | Single Step Electrolytic Method of Filling Through-Holes in Printed Circuit Boards and Other Substrates | MacDermid Enthone Inc. | Patented Case | 2026-05-19 | 12635082 | US20240224432A1 | Donald Desalvo Ron Blake Carmichael Gugliotti William J. Decesare Richard A. Bellemare | China United States United States United States United States | ABRAHAM, JOSE K |
| 2023-10-05 | 18376896 | Stretchable Interconnects for Flexible Electronic Surfaces | Alpha Assembly Solutions Inc. | Patented Case | 2025-04-15 | 12278022 | US20240029916A1 | Narahari PUJARI Bawa SINGH Ravi BHATKAL Siuli SARKAR Anubhav RUSTOGI | United States United States United States United States United States | RODD, CHRISTOPHER M |
| 2023-09-29 | 29904137 | DISPLAY SCREEN OR PORTION THEREOF WITH GRAPHICAL USER INTERFACE | Alpha Assembly Solutions Inc. | Patented Case | 2026-09-22 | D1148777 | Julia Murray Alan Gardner Erika Sebens | United States United States United States | BOLDEN, EZEKIEL D | |
| 2023-09-29 | 18374804 | Bendable Nickel Plating on Flexible Substrates | MacDermid Enthone Inc. | Patented Case | 2026-02-17 | 12553134 | US20250109499A1 | Aparna Iyer Ernest Long Kishore Viswanathan | United States United States United States | MCDONOUGH, JAMES E |
| 2023-09-19 | 18370150 | SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT | Alpha Assembly Solutions Inc. | Patented Case | 2025-08-12 | 12388042 | US20240021565A1 | Angelo GULINO Bogdan BANKIEWICZ Oscar KHASELEV Anna LIFTON Michael T. MARCZI Girard SIDONE Paul SALERNO Paul J. KOEP | United States United States United States United States United States United States United States United States | MOVVA, AMAR |
| 2023-09-06 | 18242599 | Method and Wet Chemical Compositions for Diffusion Barrier Formation | MacDermid Enthone Inc. | Patented Case | 2024-12-03 | 12157944 | US20230407467A1 | Richard W. Hurtubise Eric Yakobson Shaopeng Sun Taylor L. Wilkins Elie H. Najjar Wenbo Shao | United States United States United States United States United States United States | MCDONOUGH, JAMES E |
| 2023-06-29 | 18215929 | HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS IN EXTREME ENVIRONMENTS | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2025-09-23 | 12421574 | US20230340642A1 | Md Hasnine Lik Wai Kho | United States United States | CARDA, DANIELLE MARIE |
| 2023-06-22 | 18339865 | ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS | Kuprion Inc. | Patented Case | 2025-02-18 | 12230596 | US20230361071A1 | Alfred A. ZINN | United States | OWENS, DOUGLAS W |
| 2023-06-12 | 18257047 | MULTILAYER CORROSION SYSTEM | MacDermid, Incorporated | Patented Case | 2025-09-09 | 12410525 | US20230349049A1 | George BOKISA Adam COLBURN Bradley DURKIN Maurice MILLS Ambrose SCHAFFER | United States United States United States United States United States | CHRISTY, KATHERINE A |
| 2023-05-11 | 18036520 | Electroplating Bath for Depositing Chromium or Chromium Alloy and Process for Depositing Chromium or Chromium Alloy | MacDermid, Incorporated | Patented Case | 2026-02-10 | 12546020 | US20250263861A1 | Yoann COLL | France | HASKE, WOJCIECH |
| 2023-02-24 | 18113812 | GRAPHENE ENHANCED AND ENGINEERED MATERIALS FOR MEMBRANE TOUCH SWITCH AND OTHER FLEXIBLE ELECTRONIC STRUCTURES | MacDermid Autotype Limited Alpha Assembly Solutions Inc. | Patented Case | 2025-12-16 | 12497532 | US20230287232A1 | Nirmalya Kumar CHAKI Chetan Pravinchandra SHAH Barun DAS Supriya DEVARAJAN Siuli SARKAR Rahul RAUT Bawa SINGH Anubhav RUSTOGI Anna Jane HARRIS Keith Paul PARSONS Jeffrey William BRAHAM | India India India India India United States United States United States United Kingdom United Kingdom United Kingdom | NGUYEN, TRI V |
Similar stocks
| Stock Name | Country | Market Cap | PE Ratio |
|---|---|---|---|
| CABOT CORP (CBT) | United States | $4.062B | 24.66 |
| WD 40 CO (WDFC) | United States | $2.647B | 30.12 |
| FLOTEK INDUSTRIES INC/CN/ (FTK) | United States | $1.050B | 22.42 |
| ASP Isotopes Inc. (ASPI) | United States | $0.452B | -6.90 |
| Orion S.A. (OEC) | $0.341B | -3.89 | |
| Arq, Inc. (ARQ) | United States | $0.088B | -2.08 |
| FLEXIBLE SOLUTIONS INTERNATIONAL INC (FSI) | $0.075B | -27.31 |