Element Solutions Inc Active Patents
19 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2021-11-22: Application 17595690; Invention SOLDER PASTE FOR MODULE FABRICATION OF SOLAR CELLS; Applicant ALPHA ASSEMBLY SOLUTIONS INC.; Status Patented Case.
- 2021-11-12: Application 17524891; Invention DIELECTRIC INK COMPOSITION; Applicant Alpha Assembly Solutions Inc.; Status Patented Case.
- 2021-11-11: Application 17524450; Invention COBALT CHEMISTRY FOR SMOOTH TOPOLOGY; Applicant MacDermid Enthone Inc.; Status Patented Case.
- 2021-11-04: Application 17594978; Invention SINTER-READY SILVER FILMS; Applicant ALPHA ASSEMBLY SOLUTIONS INC.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2021-11-22 | 17595690 | SOLDER PASTE FOR MODULE FABRICATION OF SOLAR CELLS | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2026-07-21 | 12690277 | US20220216357A1 | Narahari PUJARI Siuli SARKAR Carl BILGRIEN | United States United States United States | STONER, KILEY SHAWN |
| 2021-11-12 | 17524891 | DIELECTRIC INK COMPOSITION | Alpha Assembly Solutions Inc. | Patented Case | 2024-09-10 | 12084583 | US20220064466A1 | Narahari PUJARI Jayaprakash SUNDARAMURTHY Siuli SARKAR Ravindra M. BHATKAL | India India India United States | NGUYEN, THINH H |
| 2021-11-11 | 17524450 | COBALT CHEMISTRY FOR SMOOTH TOPOLOGY | MacDermid Enthone Inc. | Patented Case | 2023-11-07 | 11807951 | US20220136123A1 | Shaopeng Sun Kyle Whitten Stephan Braye Elie Najjar | United States United States United States United States | LA VILLA, MICHAEL EUGENE |
| 2021-11-04 | 17594978 | SINTER-READY SILVER FILMS | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2025-03-11 | 12246376 | US20220241852A1 | Oscar KHASELEV Matthew James SIEBENHUHNER Monnir BOUREGHDA Mike MARCZI Carl BILGRIEN | United States United States United States United States United States | SAAD, ERIN BARRY |
| 2021-10-04 | 17493247 | SINTERING POWDER | Alpha Assembly Solutions Inc. | Patented Case | 2026-01-13 | 12522761 | US20220169905A1 | Shamik Ghoshal Ranjit Pandher Oscar Khaselev Ravi Bhatkal Rahul Raut Bawa Singh Morgana de Avila Ribas Siuli Sarkar Sutapa Mukherjee Sathish Kumar Remya Chandran Pavan Vishwanath Ashok Pachamuthu Monnir Boureghda Nitin Desai Anna Lifton Nirmalya Kumar Chaki | India United States United States United States United States United States India India India India India India India India India United States India | KESSLER, CHRISTOPHER S |
| 2021-08-31 | 17462064 | COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS | Kester LLC | Patented Case | 2023-08-15 | 11724342 | US20220080535A1 | Md Hasnine Lik Wai Kho | United States United States | MAZZOLA, DEAN A |
| 2021-08-12 | 17400633 | Copper Deposition in Wafer Level Packaging of Integrated Circuits | MacDermid Enthone Inc. | Patented Case | 2023-07-11 | 11697884 | US20210388519A1 | Thomas Richardson Kyle Whitten Vincent Paneccasio JR. John Commander Richard Hurtubise | United States United States United States United States United States | RUFO, LOUIS J |
| 2021-08-11 | 17430045 | METHOD FOR PRODUCING A CORROSION-RESISTANT ALUMINUM-SILICON ALLOY CASTING, SUCH CORROSION-RESISTANT ALUMINUM-SILICON ALLOY CASTING AND ITS USE | COVENTYA GMBH | Patented Case | 2025-08-19 | 12392048 | US20220136127A1 | Can AKYIL Pinar AFSIN Güney AKDAS Michael KRUMM | TüRkiye TüRkiye TüRkiye Germany | SCHLEIS, DANIEL J |
| 2021-07-22 | 17382980 | Stretchable Interconnects for Flexible Electronic Surfaces | Alpha Assembly Solutions Inc. | Patented Case | 2023-11-28 | 11830640 | US20210350949A1 | Narahari PUJARI Bawa SINGH Ravi BHATKAL Siuli SARKAR Anubhav RUSTOGI | United States United States United States United States United States | RODD, CHRISTOPHER M |
| 2021-06-21 | 17416703 | Composition and Method for Fabrication of Nickel Interconnects | MacDermid Enthone Inc. | Patented Case | 2025-04-08 | 12270121 | US20220064811A1 | Eric Yakobson Shaopeng Sun Elie Najjar Thomas Richardson Vincent Paneccasio Jr. Wenbo Shao Kyle Whitten | United States United States United States United States United States United States United States | WITTENBERG, STEFANIE S |
| 2021-06-21 | 17309818 | LEAD-FREE SOLDER COMPOSITIONS | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2024-10-15 | 12115602 | US20220072664A1 | Ranjit PANDHER Niveditha NAGARAJAN Anil KUMAR Morgana de Avila RIBAS Gyan DUTT Siuli SARKAR Carl BILGRIEN | United States United States United States United States United States United States United States | SAAD, ERIN BARRY |
| 2021-06-15 | 17347934 | Leveler Compositions for use in Copper Deposition in Manufacture of Microelectronics | MacDermid Enthone Inc. | Patented Case | 2025-08-26 | 12398480 | US20210310141A1 | Vincent Paneccasio JR. Kyle Whitten Thomas B. Richardson Ivan Li | United States United States United States United States | BOYLE, ROBERT C |
| 2021-04-30 | 17245397 | LOW PRESSURE SINTERING POWDER | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2024-10-08 | 12113039 | US20210249376A1 | Shamik Ghoshal Nirmalya Kumar Chaki Poulami Sengupta Roy Siuli Sarkar Anubhav Rustogi | United States United States United States United States United States | HEVEY, JOHN A |
| 2021-04-19 | 17286704 | LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED CIRCUIT BOARDS AND OTHER JOINING APPLICATIONS | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2025-02-25 | 12233483 | US20210283727A1 | Rahul RAUT Nirmalyakumar CHAKI Bawa SINGH Ranjit PANDHER Siuli SARKAR | United States United States United States United States United States | ROE, JESSEE RANDALL |
| 2021-04-05 | 17222058 | Cobalt Filling of Interconnects | MacDermid Enthone Inc. | Patented Case | 2022-08-02 | 11401618 | US20210332491A1 | John Commander Kyle Whitten Vincent Paneccasio JR. Shaopeng Sun Eric Yakobson Jianwen Han Elie Najjar | United States United States United States United States United States United States United States | RUFO, LOUIS J |
| 2021-04-01 | 17220540 | Cobalt Filling of Interconnects in Microelectronics | MacDermid Enthone Inc. | Patented Case | 2022-09-06 | 11434578 | US20210222314A1 | John Commander Vincent Paneccasio JR. Eric Rouya Kyle Whitten Shaopeng Sun Jianwen Han | United States United States United States United States United States United States | WITTENBERG, STEFANIE S |
| 2021-03-15 | 17201528 | Thermal Management In Circuit Board Assemblies | Kuprion, Inc. | Patented Case | 2024-02-20 | 11910520 | US20210227680A1 | Alfred A. Zinn | United States | CHEN, XIAOLIANG |
| 2021-02-08 | 17266749 | ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS | Kuprion Inc. | Patented Case | 2023-08-22 | 11735548 | US20210320078A1 | Alfred A. Zinn | United States | OWENS, DOUGLAS W |
| 2021-01-20 | 17153706 | METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS | ALPHA ASSEMBLY SOLUTIONS INC. | Patented Case | 2023-07-11 | 11699632 | US20210289680A1 | Monnir Boureghda Nitin Desai Anna Lifton Oscar Khaselev Michael T. Marczi Bawa Singh | United States United States United States United States United States United States | TSO, STANLEY |
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