Element Solutions Inc Active Patents
110 granted patents the USPTO still lists as patented, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2024-08-12: Application 18837688; Invention METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION THEREOF; Applicant Kuprion Inc.; Status Patented Case.
- 2024-05-08: Application 18657931; Invention CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTICLES; Applicant Kuprion Inc.; Status Patented Case.
- 2024-01-16: Application 18413275; Invention Thermal Management in Circuit Board Assemblies; Applicant Kuprion Inc.; Status Patented Case.
- 2023-12-20: Application 18390072; Invention METHOD FOR IMPROVING ADHESION BETWEEN METALLIZATION LAYERS AND OZONE-ETCHED PLASTICS; Applicant MacDermid Enthone Inc.; Status Patented Case.
| Filed | Application | Invention | Applicant | Status | Granted | Patent | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|---|---|
| 2024-08-12 | 18837688 | METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION THEREOF | Kuprion Inc. | Patented Case | 2026-08-25 | 12720675 | US20250185156A1 | Alfred A. Zinn Alex Capanzana Hannah Thanh Zinn | United States United States United States | MCALLISTER, MICHAEL F |
| 2024-05-08 | 18657931 | CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTICLES | Kuprion Inc. | Patented Case | 2026-08-18 | 12713527 | US20240292531A1 | Alfred A. Zinn Khanh Nguyen | United States United States | NG, SHERMAN |
| 2024-01-16 | 18413275 | Thermal Management in Circuit Board Assemblies | Kuprion Inc. | Patented Case | 2025-09-23 | 12426148 | US20240206048A1 | Alfred A. Zinn | United States | AYCHILLHUM, ANDARGIE M |
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