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DIODES INC /DEL/ (DIOD) Material Contracts, 2023

DIODES INC /DEL/ Material Contracts

Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.

  • 2023-06-02: Form 8-K; Exhibit 10.1; Description Third Amended and Restated Credit Agreement, dated as of May 26, 2023, by and among Diodes Incorporated, Diodes Holding UK Limited, Diodes Zetex Limited, Diodes US Manufacturing Incorporated, Bank of America, N.A., as Administrative Agent, Lender, L/C Issuer, and Swing Line Lender, and the other Lenders party thereto..
  • 2023-05-09: Form 10-Q; Exhibit 10.3; Description Amendment to Yuanhao Building Lease Agreements.
  • 2023-03-17: Form 8-K; Exhibit 10.1; Description Letter agreement dated March 17, 2023, by and between the Company and Julie Holland.
  • 2023-01-17: Form 8-K; Exhibit 10.1; Description Letter agreement dated January 13, 2023, by and between the Company and Evan Yu.
FiledFormExhibitDescription
2023-06-028-K10.1Third Amended and Restated Credit Agreement, dated as of May 26, 2023, by and among Diodes Incorporated, Diodes Holding UK Limited, Diodes Zetex Limited, Diodes US Manufacturing Incorporated, Bank of America, N.A., as Administrative Agent, Lender, L/C Issuer, and Swing Line Lender, and the other Lenders party thereto.
2023-05-0910-Q10.3Amendment to Yuanhao Building Lease Agreements
2023-03-178-K10.1Letter agreement dated March 17, 2023, by and between the Company and Julie Holland
2023-01-178-K10.1Letter agreement dated January 13, 2023, by and between the Company and Evan Yu

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