DIODES INC /DEL/ Material Contracts
Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.
- 2009-12-02: Form 8-K; Exhibit 10.1; Description Credit Agreement, dated November 25, 2009, by and among Diodes Incorporated, Diodes Zetex Limited and Bank of America, N.A..
- 2009-11-06: Form 10-Q; Exhibit 10.1; Description Second Supplemental Agreement to the Factory Building Lease Agreement dated August 19, 2009 bewteen Shanghai Kai Hong Technology Co., Ltd. And Shanghai Yuan Hao Electronic Co., Ltd..
- 2009-10-02: Form 8-K; Exhibit 10.1; Description Exchange Agreement dated September 28, 2009, between the Company and an institutional holder.
- 2009-06-15: Form 8-K; Exhibit 10.1; Description Exchange Agreement dated June 9, 2009, between the Company and Acqua Wellington Opportunity, Ltd..
| Filed | Form | Exhibit | Description |
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| 2009-12-02 | 8-K | 10.1 | Credit Agreement, dated November 25, 2009, by and among Diodes Incorporated, Diodes Zetex Limited and Bank of America, N.A. |
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| 2009-11-06 | 10-Q | 10.1 | Second Supplemental Agreement to the Factory Building Lease Agreement dated August 19, 2009 bewteen Shanghai Kai Hong Technology Co., Ltd. And Shanghai Yuan Hao Electronic Co., Ltd. |
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| 2009-10-02 | 8-K | 10.1 | Exchange Agreement dated September 28, 2009, between the Company and an institutional holder |
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| 2009-06-15 | 8-K | 10.1 | Exchange Agreement dated June 9, 2009, between the Company and Acqua Wellington Opportunity, Ltd. |
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| 2009-05-08 | 10-Q | 10.3 | Amendment to the Exhibit 1 of the Distributorship Agreement dated March 27, 2009, between Shanghai Kai Hong Technology Co., Ltd. and Shanghai Keylink Logistic Co., Ltd. |
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| 2009-05-08 | 10-Q | 10.2 | Amended Appendix to the Plating Agreement dated February 11, 2009, among Shanghai Kai Hong Electronic Co., Ltd., Diodes Shanghai Co., Ltd., Shanghai Ding Hong Electronic Co., Ltd. and Shanghai Micro-Surface Co., Ltd. |
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| 2009-05-08 | 10-Q | 10.1 | Consulting Agreement dated January 1, 2009, between Diodes Incorporated and Keylink International (BVI) Co., Ltd. |
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| 2009-02-26 | 10-K | 10.88 | Diodes Incorporated Deferred Compensation Plan Effective January 1, 2007, amended December 22, 2008. |
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| 2009-02-26 | 10-K | 10.87 | Diodes Incorporated 2001 Omnibus Equity Incentive Plan, amended December 22, 2008. |
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| 2009-02-26 | 10-K | 10.86 | 1969 Incentive Bonus Plan, amended December 22, 2008. |
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| 2009-02-26 | 10-K | 10.85 | Abbreviated Standard Form of Agreement Between Owner and Architech dated August 25, 2008 between Corgan Associates, Inc. and Diodes Incorporated. |
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| 2009-02-26 | 10-K | 10.84 | Lease Facility Safety Management Agreement dated December 31, 2008 between Shanghai Kai Hong Technology Co., Ltd. and Shanghai Yuan Howe Electronic Co., Ltd. |
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| 2009-02-26 | 10-K | 10.83 | Distributorship Agreement dated November 1, 2008 between Shanghai Kai Hong Technology Co., Ltd. and Shanghai Keylink Logistic Co., Ltd. |
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