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DIODES INC /DEL/ (DIOD) Material Contracts

DIODES INC /DEL/ Material Contracts

Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.

  • 2026-08-18: Form 8-K; Exhibit 10.2; Description Form of Confirmation for Capped Call Transactions..
  • 2026-08-18: Form 8-K; Exhibit 10.1; Description Amendment No. 1 to Third Amended and Restated Credit Agreement, dated as of August 12, 2026, by and among Diodes Incorporated, Diodes Holding UK Limited, certain subsidiaries of Diodes Incorporated party thereto, Bank of America, N.A., as Administrative Agent, and the Lenders party thereto.*.
  • 2025-05-14: Form 8-K; Exhibit 10.2; Description Amendment No. 4 to Employment Agreement, between Diodes Incorporated and Dr. Keh-Shew Lu, effective May 13, 2025.
  • 2025-05-14: Form 8-K; Exhibit 10.1; Description Employment Agreement, between Diodes Incorporated and Mr. Gary Yu effective May 13, 2025.
FiledFormExhibitDescription
2026-08-188-K10.2Form of Confirmation for Capped Call Transactions.
2026-08-188-K10.1Amendment No. 1 to Third Amended and Restated Credit Agreement, dated as of August 12, 2026, by and among Diodes Incorporated, Diodes Holding UK Limited, certain subsidiaries of Diodes Incorporated party thereto, Bank of America, N.A., as Administrative Agent, and the Lenders party thereto.*

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