Advertisement
Screener

DIODES INC /DEL/ (DIOD) Material Contracts, 2021

DIODES INC /DEL/ Material Contracts

Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.

  • 2021-05-06: Form 10-Q; Exhibit 10.4; Description EX-10.4 AMENDMENT NO. 3 TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT, DATED AS OF MARCH 4, 2021, BY AND AMONG DIODES INCORPORATED, DIODES HOLDINGS UK LIMITED, CERTAIN SUBSIDIARIES OF DIODES INCORPORATED IDENTIFIED THEREIN, THE LENDERS IDENTIFIED THEREI.
  • 2021-02-22: Form 10-K; Exhibit 10.97; Description EX-10.97 CONSENT AND AMENDMENT NO. 2 TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT DATED AS OF NOVEMBER 17, 2020. PORTIONS OF THIS EXHIBIT HAVE BEEN OMITTED.
  • 2021-02-22: Form 10-K; Exhibit 10.96; Description EX-10.96 CONSENT AGREEMENT WITH RESPECT TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT AND FOREIGN SECURITY AGREEMENTS DATED AS OF NOVEMBER 2, 2020.
  • 2021-02-22: Form 10-K; Exhibit 10.95; Description EX-10.95 FIRST AMENDMENT TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT DATED AS OF SEPTEMBER 21, 2020.
FiledFormExhibitDescription
2021-05-0610-Q10.4EX-10.4 AMENDMENT NO. 3 TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT, DATED AS OF MARCH 4, 2021, BY AND AMONG DIODES INCORPORATED, DIODES HOLDINGS UK LIMITED, CERTAIN SUBSIDIARIES OF DIODES INCORPORATED IDENTIFIED THEREIN, THE LENDERS IDENTIFIED THEREI
2021-02-2210-K10.97EX-10.97 CONSENT AND AMENDMENT NO. 2 TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT DATED AS OF NOVEMBER 17, 2020. PORTIONS OF THIS EXHIBIT HAVE BEEN OMITTED
2021-02-2210-K10.96EX-10.96 CONSENT AGREEMENT WITH RESPECT TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT AND FOREIGN SECURITY AGREEMENTS DATED AS OF NOVEMBER 2, 2020
2021-02-2210-K10.95EX-10.95 FIRST AMENDMENT TO SECOND AMENDED AND RESTATED CREDIT AGREEMENT DATED AS OF SEPTEMBER 21, 2020
2021-01-268-K10.3EX-10.3 - LETTER OF AWARENESS
2021-01-268-K10.2EX-10.2 - HONG KONG LAW DEBENTURE
2021-01-268-K10.1EX-10.1 HSBC BORROWING BASE FACILITY AGREEMENT

Similar stocks

Stock NameCountryMarket CapPE Ratio
Enphase Energy, Inc. (ENPH)United States$4.323B36.93
KULICKE & SOFFA INDUSTRIES INC (KLIC)$4.629B54.95
SYNAPTICS Inc (SYNA)United States$3.788B-9.62
AXT INC (AXTI)United States$4.975B1,164.86
Ultra Clean Holdings, Inc. (UCTT)United States$3.466B
IPG PHOTONICS CORP (IPGP)United States$3.294B181.08
OSI SYSTEMS INC (OSIS)United States$3.209B22.52
AMBARELLA INC (AMBA)United States$3.082B-67.32
POWER INTEGRATIONS INC (POWI)United States$2.838B186.40
CIRRUS LOGIC, INC. (CRUS)United States$5.956B17.19