CMC Materials, Inc. Patent Applications Rejected
7 applications abandoned without a patent; the status gives the reason, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2023-01-30: Application 18103135; Invention ENDPOINT WINDOW WITH CONTROLLED TEXTURE SURFACE; Applicant CMC Materials, Inc.; Status Abandoned -- Failure to Respond to an Office Action.
- 2022-10-24: Application 17972509; Invention COMPOSITION AND METHOD FOR COBALT CMP; Applicant CMC Materials, Inc.; Status Abandoned -- After Examiner's Answer or Board of Appeals Decision.
- 2022-02-03: Application 17592294; Invention CERIA-BASED SLURRY COMPOSITIONS FOR SELECTIVE AND NONSELECTIVE CMP OF SILICON OXIDE, SILICON NITRIDE, AND POLYSILICON; Applicant CMC Materials, Inc.; Status Abandoned -- After Examiner's Answer or Board of Appeals Decision.
- 2022-02-03: Application 17592279; Invention CERIA-BASED SLURRY COMPOSITIONS FOR SELECTIVE AND NONSELECTIVE CMP OF SILICON OXIDE, SILICON NITRIDE, AND POLYSILICON; Applicant CMC Materials, Inc.; Status Abandoned -- After Examiner's Answer or Board of Appeals Decision.
| Filed | Application | Invention | Applicant | Status | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|
| 2023-01-30 | 18103135 | ENDPOINT WINDOW WITH CONTROLLED TEXTURE SURFACE | CMC Materials, Inc. | Abandoned -- Failure to Respond to an Office Action | US20230166380A1 | Paul Andre LEFEVRE Dustin MILLER Gary SNIDER Carlos BARROS Anthony GALTO | United States United States United States United States United States | CRANDALL, JOEL DILLON |
| 2022-10-24 | 17972509 | COMPOSITION AND METHOD FOR COBALT CMP | CMC Materials, Inc. | Abandoned -- After Examiner's Answer or Board of Appeals Decision | US20230059396A1 | Fernando HUNG LOW Steven KRAFT Roman A. IVANOV Steven GRUMBINE Andrew R. WOLFF | United States United States United States United States United States | DUCLAIR, STEPHANIE P. |
| 2022-02-03 | 17592294 | CERIA-BASED SLURRY COMPOSITIONS FOR SELECTIVE AND NONSELECTIVE CMP OF SILICON OXIDE, SILICON NITRIDE, AND POLYSILICON | CMC Materials, Inc. | Abandoned -- After Examiner's Answer or Board of Appeals Decision | US20230242791A1 | Brian REISS Juyeon CHANG Shengyu JIN Helin HUANG | United States United States United States United States | AHMED, SHAMIM |
| 2022-02-03 | 17592279 | CERIA-BASED SLURRY COMPOSITIONS FOR SELECTIVE AND NONSELECTIVE CMP OF SILICON OXIDE, SILICON NITRIDE, AND POLYSILICON | CMC Materials, Inc. | Abandoned -- After Examiner's Answer or Board of Appeals Decision | US20230242790A1 | Brian Reiss Juyeon Chang Shengyu Jin Helin Huang | United States United States United States United States | AHMED, SHAMIM |
| 2021-10-29 | 17607743 | CHEMICAL-MECHANICAL POLISHING PAD WITH TEXTURED PLATEN ADHESIVE | CMC Materials, Inc. | Abandoned -- Failure to Respond to an Office Action | US20220203497A1 | Paul Andre LEFEVRE Jason JEWETT Eric EICHENBAUM Holland HODGES | United States United States United States United States | ROSEN, ERIC J |
| 2021-09-17 | 17478690 | CHEMICAL MECHANICAL PLANARIZATION PAD WITH A RELEASE LINER COMPRISING A PULL TAB | CMC Materials, Inc. | Abandoned -- Failure to Respond to an Office Action | US20230090077A1 | Justin Stewart Gary Snider Carlos Barros | United States United States United States | HUANG, STEVEN |
| 2021-07-19 | 17379279 | SILICON WAFER POLISHING COMPOSITION AND METHOD | CMC Materials, Inc. | Abandoned -- Failure to Respond to an Office Action | US20220017781A1 | Hiroshi KITAMURA Tsuyoshi MASUDA Yoshiyuki MATSUMURA Akihisa NAMIKI Takeshi SAITO | Japan Japan Japan Japan Japan | LU, JIONG-PING |