United Microelectronics Corporation Repayments Of Bonds Notes And Debentures
United Microelectronics Corporation (UMC) reported Repayments Of Bonds Notes And Debentures of TWD 8.50 billion for the 12-month period ending 2024-12-31, per its 20-F filed 2025-04-24.
Financial Statements › Cash Flow › Financing Activities
ifrs-full:RepaymentsOfBondsNotesAndDebentures · last filed 2025-04-24
TWD
| Period end | Repayments Of Bonds Notes And Debentures 12 month |
|---|---|
| 2024-12-31 | 8.50B TWD 20-F · filed 2025-04-24 |
| 2023-12-31 | 0.00 TWD 20-F · filed 2025-04-24 |
| 2022-12-31 | 13.31B TWD 20-F · filed 2025-04-24 |
| 2021-12-31 | 2.00B TWD 20-F · filed 2024-04-25 |
| 2020-12-31 | 13.70B TWD 20-F · filed 2023-04-27 |
| 2019-12-31 | 2.50B TWD 20-F · filed 2022-04-28 |
| 2018-12-31 | 7.50B TWD 20-F · filed 2021-04-29 |
| 2017-12-31 | 7.50B TWD 20-F · filed 2020-04-28 |
| 2016-12-31 | 0.00 TWD 20-F · filed 2019-04-25 |
| 2015-12-31 | 0.00 TWD 20-F · filed 2018-04-26 |
USD
| Period end | Repayments Of Bonds Notes And Debentures 12 month |
|---|---|
| 2024-12-31 | $259.23M 20-F · filed 2025-04-24 |
| 2023-12-31 | $0.00 20-F · filed 2024-04-25 |
| 2022-12-31 | $432.97M 20-F · filed 2023-04-27 |
| 2021-12-31 | $72.10M 20-F · filed 2022-04-28 |
| 2020-12-31 | $487.99M 20-F · filed 2021-04-29 |
| 2019-12-31 | $83.58M 20-F · filed 2020-04-28 |
| 2018-12-31 | $245.02M 20-F · filed 2019-04-25 |
| 2017-12-31 | $253.04M 20-F · filed 2018-04-26 |