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United Microelectronics Corporation (UMC) Proceeds From Issue Of Bonds Notes And Debentures

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United Microelectronics Corporation Proceeds From Issue Of Bonds Notes And Debentures

United Microelectronics Corporation (UMC) reported Proceeds From Issue Of Bonds Notes And Debentures of TWD 0 for the 12-month period ending 2024-12-31, per its 20-F filed 2025-04-24.

Financial Statements › Cash Flow › Financing Activities

ifrs-full:ProceedsFromIssueOfBondsNotesAndDebentures · last filed 2025-04-24

TWD

Period endProceeds From Issue Of Bonds Notes And Debentures 12 month
2024-12-310.00 TWD
20-F · filed 2025-04-24
2023-12-3110.00B TWD
20-F · filed 2025-04-24
2022-12-310.00 TWD
20-F · filed 2025-04-24
2021-12-3125.76B TWD
20-F · filed 2024-04-25
2020-12-310.00 TWD
20-F · filed 2023-04-27
2019-12-310.00 TWD
20-F · filed 2022-04-28
2018-12-310.00 TWD
20-F · filed 2020-04-28
2017-12-3113.70B TWD
20-F · filed 2020-04-28
2016-12-310.00 TWD
20-F · filed 2019-04-25
2015-12-3118.42B TWD
20-F · filed 2018-04-26

USD

Period endProceeds From Issue Of Bonds Notes And Debentures 12 month
2024-12-31$0.00
20-F · filed 2025-04-24
2023-12-31$326.58M
20-F · filed 2024-04-25
2022-12-31$0.00
20-F · filed 2023-04-27
2021-12-31$928.65M
20-F · filed 2022-04-28
2019-12-31$0.00
20-F · filed 2020-04-28
2018-12-31$0.00
20-F · filed 2019-04-25
2017-12-31$462.21M
20-F · filed 2018-04-26