United Microelectronics Corporation Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued
United Microelectronics Corporation (UMC) had Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued of TWD 5.47 billion as of 2024-12-31, per its 20-F filed 2025-04-24.
Financial Statements › Notes
ifrs-full:CurrentBondsIssuedAndCurrentPortionOfNoncurrentBondsIssued · last filed 2025-04-24
- 2024-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 5.47B TWD.
- 2023-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 13.78B TWD.
- 2022-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 5.10B TWD.
- 2021-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 17.46B TWD.
| Period end | Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued |
|---|---|
| 2024-12-31 | 5.47B TWD 20-F · filed 2025-04-24 |
| 2023-12-31 | 13.78B TWD 20-F · filed 2025-04-24 |
| 2022-12-31 | 5.10B TWD 20-F · filed 2024-04-25 |
| 2021-12-31 | 17.46B TWD 20-F · filed 2023-04-27 |
| 2020-12-31 | 2.00B TWD 20-F · filed 2022-04-28 |
| 2019-12-31 | 20.09B TWD 20-F · filed 2021-04-29 |
| 2018-12-31 | 2.50B TWD 20-F · filed 2020-04-28 |
| 2017-12-31 | 24.84B TWD 20-F · filed 2019-04-25 |
| 2016-12-31 | 7.50B TWD 20-F · filed 2018-04-26 |