United Microelectronics Corporation Bonds Issued
United Microelectronics Corporation (UMC) had Bonds Issued of TWD 30.05 billion as of 2024-12-31, per its 20-F filed 2025-04-24.
Financial Statements › Notes
ifrs-full:BondsIssued · last filed 2025-04-24
- 2024-12-31: Bonds Issued 30.05B TWD.
- 2023-12-31: Bonds Issued 38.36B TWD.
- 2022-12-31: Bonds Issued 28.18B TWD.
- 2021-12-31: Bonds Issued 40.54B TWD.
TWD
| Period end | Bonds Issued |
|---|---|
| 2024-12-31 | 30.05B TWD 20-F · filed 2025-04-24 |
| 2023-12-31 | 38.36B TWD 20-F · filed 2025-04-24 |
| 2022-12-31 | 28.18B TWD 20-F · filed 2024-04-25 |
| 2021-12-31 | 40.54B TWD 20-F · filed 2023-04-27 |
| 2020-12-31 | 18.69B TWD 20-F · filed 2022-04-28 |
| 2019-12-31 | 38.78B TWD 20-F · filed 2021-04-29 |
| 2018-12-31 | 41.38B TWD 20-F · filed 2020-04-28 |
| 2017-12-31 | 48.52B TWD 20-F · filed 2019-04-25 |
| 2016-12-31 | 41.98B TWD 20-F · filed 2018-04-26 |
USD
| Period end | Bonds Issued |
|---|---|
| 2015-05-18 | $600.00M 20-F · filed 2022-04-28 |