Taiwan Semiconductor Manufacturing Company Limited Debt Instruments Amount Contributed To Fair Value Of Plan Assets
Taiwan Semiconductor Manufacturing Company Limited (TSMWF) had Debt Instruments Amount Contributed To Fair Value Of Plan Assets of TWD 2.94 billion as of 2024-12-31, per its 20-F filed 2025-04-17.
Financial Statements › Notes
ifrs-full:DebtInstrumentsAmountContributedToFairValueOfPlanAssets · last filed 2025-04-17
- 2024-12-31: Debt Instruments Amount Contributed To Fair Value Of Plan Assets 2.94B TWD.
- 2023-12-31: Debt Instruments Amount Contributed To Fair Value Of Plan Assets 2.39B TWD.
- 2022-12-31: Debt Instruments Amount Contributed To Fair Value Of Plan Assets 2.13B TWD.
- 2021-12-31: Debt Instruments Amount Contributed To Fair Value Of Plan Assets 1.60B TWD.
| Period end | Debt Instruments Amount Contributed To Fair Value Of Plan Assets |
|---|---|
| 2024-12-31 | 2.94B TWD 20-F · filed 2025-04-17 |
| 2023-12-31 | 2.39B TWD 20-F · filed 2025-04-17 |
| 2022-12-31 | 2.13B TWD 20-F · filed 2024-04-18 |
| 2021-12-31 | 1.60B TWD 20-F · filed 2023-04-20 |
| 2020-12-31 | 1.51B TWD 20-F · filed 2022-04-14 |
| 2019-12-31 | 1.27B TWD 20-F · filed 2021-04-16 |
| 2018-12-31 | 1.11B TWD 20-F · filed 2020-04-15 |
| 2017-12-31 | 1.22B TWD 20-F · filed 2019-04-17 |
| 2016-12-31 | 1.26B TWD 20-F · filed 2018-04-19 |