Taiwan Semiconductor Manufacturing Company Limited Current Dividend Payables
Taiwan Semiconductor Manufacturing Company Limited (TSMWF) had Current Dividend Payables of TWD 220.42 billion as of 2024-12-31, per its 20-F filed 2025-04-17.
Financial Statements › Notes › Equity
ifrs-full:CurrentDividendPayables · last filed 2025-04-17
- 2024-12-31: Current Dividend Payables 220.42B TWD.
- 2023-12-31: Current Dividend Payables 168.56B TWD.
- 2022-12-31: Current Dividend Payables 142.62B TWD.
- 2021-12-31: Current Dividend Payables 142.62B TWD.
TWD
| Period end | Current Dividend Payables |
|---|---|
| 2024-12-31 | 220.42B TWD 20-F · filed 2025-04-17 |
| 2023-12-31 | 168.56B TWD 20-F · filed 2025-04-17 |
| 2022-12-31 | 142.62B TWD 20-F · filed 2024-04-18 |
| 2021-12-31 | 142.62B TWD 20-F · filed 2023-04-20 |
| 2021-06-30 | 136.13B TWD 6-K · filed 2021-10-18 |
| 2020-12-31 | 129.65B TWD 20-F · filed 2022-04-14 |
| 2019-12-31 | 129.65B TWD 20-F · filed 2021-04-16 |
USD
| Period end | Current Dividend Payables |
|---|---|
| 2024-12-31 | $6.72B 20-F · filed 2025-04-17 |
| 2023-12-31 | $5.50B 20-F · filed 2024-04-18 |
| 2022-12-31 | $4.64B 20-F · filed 2023-04-20 |
| 2021-12-31 | $5.14B 20-F · filed 2022-04-14 |
| 2021-06-30 | $4.88B 6-K · filed 2021-10-18 |
| 2020-12-31 | $4.62B 20-F · filed 2021-04-16 |
| 2019-12-31 | $4.33B 20-F · filed 2020-04-15 |