Taiwan Semiconductor Manufacturing Company Limited Gross Loan Commitments
Taiwan Semiconductor Manufacturing Company Limited (TSM) had Gross Loan Commitments of EUR 4.20 billion as of 2021-06-30, per its 6-K filed 2021-10-18.
Discontinued › Notes
ifrs-full:GrossLoanCommitments · last filed 2021-10-18
- 2021-06-30: Gross Loan Commitments 4.20B EUR.
- 2020-12-31: Gross Loan Commitments 2.40B EUR.
- 2019-12-31: Gross Loan Commitments 1.41B EUR.
- 2018-12-31: Gross Loan Commitments 242.00M EUR.
EUR
| Period end | Gross Loan Commitments |
|---|---|
| 2021-06-30 | 4.20B EUR 6-K · filed 2021-10-18 |
| 2020-12-31 | 2.40B EUR 6-K · filed 2021-10-18 |
| 2019-12-31 | 1.41B EUR 20-F · filed 2021-04-16 |
| 2018-12-31 | 242.00M EUR 20-F · filed 2020-04-15 |
USD
| Period end | Gross Loan Commitments |
|---|---|
| 2020-12-31 | $200.00M 6-K · filed 2021-10-18 |
| 2019-12-31 | $2.37B 20-F · filed 2021-04-16 |
| 2018-12-31 | $2.61B 20-F · filed 2020-04-15 |
| 2017-12-31 | $2.15B 20-F · filed 2019-04-17 |
| 2016-12-31 | $1.80B 20-F · filed 2018-04-19 |