Taiwan Semiconductor Manufacturing Company Limited Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued
Taiwan Semiconductor Manufacturing Company Limited (TSM) had Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued of TWD 57.15 billion as of 2024-12-31, per its 20-F filed 2025-04-17.
Financial Statements › Notes
ifrs-full:CurrentBondsIssuedAndCurrentPortionOfNoncurrentBondsIssued · last filed 2025-04-17
- 2024-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 57.15B TWD.
- 2023-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 7.00B TWD.
- 2022-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 18.10B TWD.
- 2021-12-31: Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued 4.40B TWD.
| Period end | Current Bonds Issued And Current Portion Of Noncurrent Bonds Issued |
|---|---|
| 2024-12-31 | 57.15B TWD 20-F · filed 2025-04-17 |
| 2023-12-31 | 7.00B TWD 20-F · filed 2025-04-17 |
| 2022-12-31 | 18.10B TWD 20-F · filed 2024-04-18 |
| 2021-12-31 | 4.40B TWD 20-F · filed 2023-04-20 |
| 2020-12-31 | 2.60B TWD 20-F · filed 2022-04-14 |
| 2019-12-31 | 31.80B TWD 20-F · filed 2021-04-16 |
| 2018-12-31 | 34.90B TWD 20-F · filed 2020-04-15 |
| 2017-12-31 | 58.40B TWD 20-F · filed 2019-04-17 |
| 2016-12-31 | 38.10B TWD 20-F · filed 2018-04-19 |