TOWER SEMICONDUCTOR LTD. Debt Instrument, Convertible, Carrying Amount of Equity Component
TOWER SEMICONDUCTOR LTD. (TSEM) had Debt Instrument, Convertible, Carrying Amount of Equity Component of $18.96 million as of 2022-12-31, per its 20-F filed 2023-05-16.
Discontinued › Notes › Debt › Debt Instruments
us-gaap:DebtInstrumentConvertibleCarryingAmountOfTheEquityComponent · last filed 2023-05-16
- 2022-12-31: Debt Instrument, Convertible, Carrying Amount of Equity Component $18.96M.
- 2021-12-31: Debt Instrument, Convertible, Carrying Amount of Equity Component $64.08M.
- 2020-12-31: Debt Instrument, Convertible, Carrying Amount of Equity Component $102.40M.
- 2019-12-31: Debt Instrument, Convertible, Carrying Amount of Equity Component $132.28M.
| Period end | Debt Instrument, Convertible, Carrying Amount of Equity Component |
|---|---|
| 2022-12-31 | $18.96M 20-F · filed 2023-05-16 |
| 2021-12-31 | $64.08M 20-F · filed 2022-04-29 |
| 2020-12-31 | $102.40M 20-F · filed 2021-04-30 |
| 2019-12-31 | $132.28M 20-F · filed 2020-04-30 |
| 2018-12-31 | $120.17M 20-F · filed 2020-04-30 |
| 2017-12-31 | $181.66M 20-F · filed 2019-04-25 |
| 2016-12-31 | $169.20M 20-F · filed 2017-04-10 |
| 2015-12-31 | $52.06M 20-F · filed 2017-04-10 |