INTERLINK ELECTRONICS, INC Material Contracts
Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.
- 2024-05-09: Form 10-Q; Exhibit 10.1; Description Lease, dated February 29, 2024 between Dollinger Fremont Associates and Interlink Electronics, Inc..
- 2021-10-25: Form 8-K; Exhibit 10.2; Description Registration Rights Agreement, dated October 22, 2021, between the Registrant and the investors party thereto..
- 2021-10-25: Form 8-K; Exhibit 10.1; Description Securities Purchase Agreement, dated October 21, 2021, between the Registrant and the investors party thereto..
- 2020-11-17: Form 8-K; Exhibit 10.1; Description Employment Offer Letter, dated November 4, 2020, between the Registrant and Ryan Hoffman..
| Filed | Form | Exhibit | Description |
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| 2024-05-09 | 10-Q | 10.1 | Lease, dated February 29, 2024 between Dollinger Fremont Associates and Interlink Electronics, Inc. |
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| 2021-10-25 | 8-K | 10.2 | Registration Rights Agreement, dated October 22, 2021, between the Registrant and the investors party thereto. |
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| 2021-10-25 | 8-K | 10.1 | Securities Purchase Agreement, dated October 21, 2021, between the Registrant and the investors party thereto. |
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| 2020-11-17 | 8-K | 10.1 | Employment Offer Letter, dated November 4, 2020, between the Registrant and Ryan Hoffman. |
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| 2018-06-28 | 8-K | 10.1 | Securities Purchase Agreement |
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| 2018-01-11 | 8-K | 10.1 | |
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| 2016-08-24 | 8-K | 10.1 | Employment Offer Letter, dated July 11, 2016, between the Registrant and David S. Burnett. |
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| 2016-07-11 | 8-K | 10.1 | Employment Agreement, dated July 7, 2016, between the Registrant and Steven N. Bronson |
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| 2016-06-22 | 8-K | 10.1 | Interlink Electronics, Inc. 2016 Omnibus Incentive Plan. |
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