TESSERA TECHNOLOGIES INC Patent Applications Pending
1 applications still open at the USPTO, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2015-05-18: Application 62162813; Invention THROUGH DIELECTRIC VIAS (TDV) IN SILICON FOR 3D INTEGRATED CIRCUITS; Applicant TESSERA TECHNOLOGIES, INC; Status Provisional Application Expired.
| Filed | Application | Invention | Applicant | Status | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|
| 2015-05-18 | 62162813 | THROUGH DIELECTRIC VIAS (TDV) IN SILICON FOR 3D INTEGRATED CIRCUITS | TESSERA TECHNOLOGIES, INC | Provisional Application Expired | CYPRIAN UZOH | United States |