Sunlands Technology Group Additional Paid in Capital, Common Stock
Sunlands Technology Group (STG) had Additional Paid in Capital, Common Stock of CNY 2.29 billion as of 2025-12-31, per its 20-F filed 2026-04-24.
Financial Statements › Balance Sheet › Equity › Equity, Including Portion Attributable to Noncontrolling Interest › Equity, Attributable to Parent
us-gaap:AdditionalPaidInCapitalCommonStock · last filed 2026-04-24
- 2025-12-31: Additional Paid in Capital, Common Stock 2.29B CNY.
- 2024-12-31: Additional Paid in Capital, Common Stock 2.29B CNY.
- 2023-12-31: Additional Paid in Capital, Common Stock 2.31B CNY.
- 2022-12-31: Additional Paid in Capital, Common Stock 2.31B CNY.
CNY
| Period end | Additional Paid in Capital, Common Stock |
|---|---|
| 2025-12-31 | 2.29B CNY 20-F · filed 2026-04-24 |
| 2024-12-31 | 2.29B CNY 20-F · filed 2026-04-24 |
| 2023-12-31 | 2.31B CNY 20-F · filed 2025-04-25 |
| 2022-12-31 | 2.31B CNY 20-F · filed 2024-04-25 |
| 2021-12-31 | 2.36B CNY 20-F · filed 2023-04-25 |
| 2020-12-31 | 2.37B CNY 20-F · filed 2022-04-27 |
| 2019-12-31 | 2.36B CNY 20-F · filed 2021-04-16 |
| 2018-12-31 | 2.39B CNY 20-F · filed 2020-04-24 |
| 2017-12-31 | 289.67M CNY 20-F · filed 2019-04-26 |
USD
| Period end | Additional Paid in Capital, Common Stock |
|---|---|
| 2025-12-31 | $327.12M 20-F · filed 2026-04-24 |
| 2024-12-31 | $314.33M 20-F · filed 2025-04-25 |
| 2023-12-31 | $324.66M 20-F · filed 2024-04-25 |
| 2022-12-31 | $334.88M 20-F · filed 2023-04-25 |
| 2021-12-31 | $371.01M 20-F · filed 2022-04-27 |
| 2020-12-31 | $362.78M 20-F · filed 2021-04-16 |
| 2019-12-31 | $339.57M 20-F · filed 2020-04-24 |
| 2018-12-31 | $347.88M 20-F · filed 2019-04-26 |