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RUBICON TECHNOLOGY, INC. Patents: Expired

RUBICON TECHNOLOGY, INC. Expired Patents

3 granted patents the USPTO lists as expired; the status gives the reason, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.

  • 2014-12-08: Application 14563225; Invention INTELLIGENT MACHINES AND PROCESS FOR PRODUCTION OF MONOCRYSTALLINE PRODUCTS WITH GONIOMETER CONTINUAL FEEDBACK; Applicant Rubicon Technology, Inc.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
  • 2013-11-06: Application 14073602; Invention METHOD FOR CREATING ASYMMETRICAL WAFER; Applicant Rubicon Technology, Inc.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
  • 2013-06-06: Application 13911828; Invention ULTRA-FLAT, HIGH THROUGHPUT WAFER LAPPING PROCESS; Applicant Rubicon Technology, Inc.; Status Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362.
FiledApplicationInventionApplicantStatusGrantedPatentPublished asInventor nameInventor countryExaminer
2014-12-0814563225INTELLIGENT MACHINES AND PROCESS FOR PRODUCTION OF MONOCRYSTALLINE PRODUCTS WITH GONIOMETER CONTINUAL FEEDBACKRubicon Technology, Inc.Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.3622015-09-159134260US20150092920A1
Srikanth KAMIREDDI
United States
KIKNADZE, IRAKLI
2013-11-0614073602METHOD FOR CREATING ASYMMETRICAL WAFERRubicon Technology, Inc.Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.3622016-07-129390906
Michael W. MATTHEWS
Sunil B. PHATAK
Germany
United States
O'HERN, BRENT T
2013-06-0613911828ULTRA-FLAT, HIGH THROUGHPUT WAFER LAPPING PROCESSRubicon Technology, Inc.Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.3622014-05-278734207
Donggeun KO
United States
RACHUBA, MAURINA T