QUALCOMM INC/DE Material Contracts
Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.
- 2022-11-02: Form 10-K; Exhibit 10.19; Description Qualcomm Incorporated 2023 Director Compensation Plan. (2).
- 2022-04-27: Form 10-Q; Exhibit 10.27; Description Letter Agreement, dated as of January 24, 2022, by and among QUALCOMM Incorporated, SSW HoldCo LP, SSW Merger Sub Corp and SSW Investors LP. (1).
- 2022-02-02: Form 10-Q; Exhibit 10.26; Description Form of Annual Cash Incentive Plan Performance Unit Agreement (2022 Form). (2).
- 2022-02-02: Form 10-Q; Exhibit 10.25; Description LIBOR Transition Amendment to Credit Agreement, dated as of December 21, 2021, by and between QUALCOMM Incorporated and Bank of America, N.A., as administrative agent..
| Filed | Form | Exhibit | Description |
|---|
| 2022-11-02 | 10-K | 10.19 | Qualcomm Incorporated 2023 Director Compensation Plan. (2) |
|---|
| 2022-04-27 | 10-Q | 10.27 | Letter Agreement, dated as of January 24, 2022, by and among QUALCOMM Incorporated, SSW HoldCo LP, SSW Merger Sub Corp and SSW Investors LP. (1) |
|---|
| 2022-02-02 | 10-Q | 10.26 | Form of Annual Cash Incentive Plan Performance Unit Agreement (2022 Form). (2) |
|---|
| 2022-02-02 | 10-Q | 10.25 | LIBOR Transition Amendment to Credit Agreement, dated as of December 21, 2021, by and between QUALCOMM Incorporated and Bank of America, N.A., as administrative agent. |
|---|