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PHOTRONICS, INC. (PLAB) Material Contracts, 2019

PHOTRONICS, INC. Material Contracts

Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.

  • 2019-12-23: Form 10-K; Exhibit 10.29; Description Amendment No. 1 to the Investment Agreement between Xiamen Torch Hi-Tech Industrial Development Zone Management Committee and Photronics Singapore Pte, Ltd #*.
  • 2019-12-23: Form 10-K; Exhibit 10.23; Description License Agreement dated November 20, 2013, between Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.#.
  • 2019-12-23: Form 10-K; Exhibit 10.18; Description Executive Employment Agreement between the Company and Christopher J. Progler, Vice President, Chief Technology Officer dated September 10, 2007.+.
  • 2019-12-23: Form 10-K; Exhibit 10.7; Description The Company’s 2007 Long-Term Equity Incentive Plan.+.
FiledFormExhibitDescription
2019-12-2310-K10.29Amendment No. 1 to the Investment Agreement between Xiamen Torch Hi-Tech Industrial Development Zone Management Committee and Photronics Singapore Pte, Ltd #*
2019-12-2310-K10.23License Agreement dated November 20, 2013, between Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.#
2019-12-2310-K10.18Executive Employment Agreement between the Company and Christopher J. Progler, Vice President, Chief Technology Officer dated September 10, 2007.+
2019-12-2310-K10.7The Company’s 2007 Long-Term Equity Incentive Plan.+
2019-12-2310-K10.5Amendment to the Employee Stock Plan as of December 18, 2019*
2019-09-0510-Q10.28Master Lease Agreement Number: 48869-90000 between the Company and Banc of America Leasing & Capital, LLC dated July 25, 2019

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