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PHOTRONICS, INC. (PLAB) Material Contracts, 2015

PHOTRONICS, INC. Material Contracts

Every material contract the company filed as Exhibit 10 (executive pay plans, credit agreements, supplier and indemnity agreements), newest first, with the filing's own description.

  • 2015-09-09: Form 10-Q; Exhibit 10.31; Description Executive Employment Agreement between the Company and Constantine Macricostas dated May 4, 2015..
  • 2015-09-09: Form 10-Q; Exhibit 10.28; Description Executive Employment Agreement between the Company and Peter Kirlin dated May 4, 2015..
  • 2015-07-08: Form 10-K/A; Exhibit 10.25; Description Merger Agreement dated January 16, 2014 between Photronics Semiconductor Mask Corporation and DNP Photomask Technology Taiwan Co. Ltd.*#.
  • 2015-07-08: Form 10-K/A; Exhibit 10.24; Description Margin Agreement dated November 20, 2013 between the Company, Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#.
FiledFormExhibitDescription
2015-09-0910-Q10.31Executive Employment Agreement between the Company and Constantine Macricostas dated May 4, 2015.
2015-09-0910-Q10.28Executive Employment Agreement between the Company and Peter Kirlin dated May 4, 2015.
2015-07-0810-K/A10.25Merger Agreement dated January 16, 2014 between Photronics Semiconductor Mask Corporation and DNP Photomask Technology Taiwan Co. Ltd.*#
2015-07-0810-K/A10.24Margin Agreement dated November 20, 2013 between the Company, Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#
2015-07-0810-K/A10.23License Agreement dated November 20, 2013 between Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#
2015-07-0810-K/A10.22License Agreement dated November 20, 2013 between the Company and Photronics Semiconductor Mask Corporation.*#
2015-07-0810-K/A10.21Outsourcing Agreement dated November 20, 2013 between the Company, Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#
2015-07-0810-K/A10.20Joint Venture Operating Agreement dated November 20, 2013 between the Company and Dai Nippon Printing Co., Ltd.*#
2015-07-0810-K/A10.19Joint Venture Framework Agreement dated November 20, 2013 between the Company and Dai Nippon Printing Co., Ltd*#
2015-06-0410-Q10.18Outsource Supply Agreement between Micron and Photronics dated March 24, 2015#
2015-06-0410-Q10.16Bridge License Agreement between Micron and Photronics dated March 24, 2015#
2015-01-0610-K10.33Second Amended and Restated Security Agreement.*
2015-01-0610-K10.32Amendment No. 1 dated as of August 22, 2014 to the Third Amended and Restated Credit Agreement dated as of December 5, 2013.*
2015-01-0610-K10.25Merger Agreement dated January 16, 2014 between Photronics Semiconductor Mask Corporation and DNP Photomask Technology Taiwan Co. Ltd.*#
2015-01-0610-K10.24Margin Agreement dated November 20, 2013 between the Company, Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#
2015-01-0610-K10.23License Agreement dated November 20, 2013 between Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#
2015-01-0610-K10.22License Agreement dated November 20, 2013 between the Company and Photronics Semiconductor Mask Corporation.*#
2015-01-0610-K10.21Outsourcing Agreement dated November 20, 2013 between the Company, Dai Nippon Printing Co., Ltd and Photronics Semiconductor Mask Corporation.*#
2015-01-0610-K10.20Joint Venture Operating Agreement dated November 20, 2013 between the Company and Dai Nippon Printing Co., Ltd.*#
2015-01-0610-K10.19Joint Venture Framework Agreement dated November 20, 2013 between the Company and Dai Nippon Printing Co., Ltd*#
2015-01-0610-K10.12Executive Employment Agreement between the Company and Sean T. Smith dated February 20, 2003+*
2015-01-0610-K10.92011 Executive Incentive Compensation Plan effective as of November 1, 2010+*
2015-01-0610-K10.8Amendment to the 2007 Long Term Equity Incentive Plan as of April 11, 2014+*
2015-01-0610-K10.1Master Service Agreement dated January 11, 2002 between the Company and RagingWire Telecommunications, Inc.*

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