KOMATSU LTD Patent Applications Rejected
1 applications abandoned without a patent; the status gives the reason, newest filing first, as the USPTO Open Data Portal records them; the company is the first-named applicant. The application number opens the full record at Patent Center.
- 2016-10-25: Application 15306535; Invention TERMINAL CONNECTION STRUCTURE OF POWER SEMICONDUCTOR MODULE; Applicant Komatsu Ltd.; Status Abandoned -- Failure to Pay Issue Fee.
| Filed | Application | Invention | Applicant | Status | Published as | Inventor name | Inventor country | Examiner |
|---|---|---|---|---|---|---|---|---|
| 2016-10-25 | 15306535 | TERMINAL CONNECTION STRUCTURE OF POWER SEMICONDUCTOR MODULE | Komatsu Ltd. | Abandoned -- Failure to Pay Issue Fee | Junichirou Tsuchiya Yuichi Kato Akihiko Souda | Japan Japan Japan | HARVEY, JAMES R |